Abstract
Within the last decade, inkjet printing technology has developed from only a text and graphic industry to a major topic of scientific research and development. Inkjet printing can be used as a highly reproducible noncontact patterning technique to print at high speeds either small or large areas with high quality features; it requires only small amounts of functional materials, which immediately lower production costs. Furthermore, inkjet printing reduces the amount of processing steps due to its additive technique of materials deposition, which further decreases productions costs. This contribution provides a literature survey covering the latest results in low temperature sintering inkjet-printed metal precursor materials in a fast and efficient manner, aiming for roll-to-roll processing. The prepared features can be used as interconnects and contacts for microelectronic applications, including organic light-emitting diodes, organic photovoltaics, and radio frequency identification tags.
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References
IDTechEx: http://www.IDTechEx.com/pe (accessed April 3, 2012).
V. Subramanian, J.M.J. Frechet, P.C. Chang, D.C. Huang, J.B. Lee, S.E. Molesa, A.R. Murphy, D.R. Redinger, and S.K. Volkman: Progress toward development of all-printed RFID tags: Materials, processes, and devices. Proc. IEEE 93, 1330 (2005).
K. Woo, C. Bae, Y. Jeong, D. Kim, and J. Moon: Inkjet-printed Cu source/drain electrodes for solution-deposited thin film transistors. J. Mater. Chem. 20, 3877 (2010).
A.R. Liberski, J.T. Delaney, A. Liberska, J. Perelaer, M. Schwarz, T. Schüler, R. Möller, and U.S. Schubert: Printed conductive features for DNA chip applications prepared on PET without sintering. RSC Adv. 2, 2308 (2012).
J. Perelaer, P.J. Smith, D. Mager, D. Soltman, S.K. Volkman, V. Subramanian, J.G. Korvink, and U.S. Schubert: Printed electronics: The challenges involved in printing devices, interconnects, and contacts based on inorganic materials. J. Mater. Chem. 20, 8446 (2010).
M. Helgesen, R. Sondergaard, and F.C. Krebs: Advanced materials and processes for polymer solar cell devices. J. Mater. Chem. 20, 36 (2010).
M. Singh, H.M. Haverinen, P. Dhagat, and G.E. Jabbour: Inkjet printing - process and its applications. Adv. Mater. 22, 673 (2010).
A. Kamyshny, J. Steinke, and S. Magdassi: Metal-based inkjet inks for printed electronics. Open Appl. Phys. J. 4, 19 (2011).
A.L. Dearden, P.J. Smith, D.Y. Shin, N. Reis, B. Derby, and P. O’Brien: A low curing temperature silver ink for use in ink-jet printing and subsequent production of conductive tracks. Macromol. Rapid Commun. 26, 315 (2005).
S. Gamerith, A. Klug, H. Scheiber, U. Scherf, E. Moderegger, and E.J.W. List: Direct ink-jet printing of Ag-Cu nanoparticle and Ag-precursor based electrodes for OFET applications. Adv. Funct. Mater. 17, 3111 (2007).
P. Buffat and J.P. Borel: Size effect on melting temperature of gold particles. Phys. Rev. A 13, 2287 (1976).
G.L. Allen, R.A. Bayles, W.W. Gile, and W.A. Jesser: Small particle melting of pure metals. Thin Solid Films 144, 297 (1986).
J. Perelaer, A.W.M. de Laat, C.E. Hendriks, and U.S. Schubert: Inkjet-printed silver tracks: low temperature curing and thermal stability investigation. J. Mater. Chem. 18, 3209 (2008).
S-J.L. Kang: Sintering: Densification, Grain Growth, and Microstructure, 1st ed. (Elsevier Butterworth-Heinemann, Burlington, 2005), pp. 37–77.
R.S. Goeke and A.K. Datye: Model oxide supports for studies of catalyst sintering at elevated temperatures. Top. Catal. 46, 3 (2007).
B. Ingham, T.H. Lim, C.J. Dotzler, A. Henning, M.F. Toney, and R.D. Tilley: How nanoparticles coalesce: An in situ study of Au nanoparticle aggregation and grain growth. Chem. Mater. 23, 3312 (2011).
S.K. Volkman, S. Yin, T. Bakhishev, K. Puntambekar, V. Subramanian, and M.F. Toney: Mechanistic studies on sintering of silver nanoparticles. Chem. Mater. 23, 4634 (2011).
J.R. Greer and R.A. Street: Thermal cure effects on electrical performance of nanoparticle silver inks. Acta Mater. 55, 6345 (2007).
L.H. Liang, C.M. Shen, S.X. Du, W.M. Liu, X.C. Xie, and H.J. Gao: Increase in thermal stability induced by organic coatings on nanoparticles. Phys. Rev. B 70, 205419 (2004).
J. Miettinen, V. Pekkanen, K. Kaija, P. Mansikkamäki, J. Mäntysalo, M. Mäntysalo, J. Niittynen, J. Pekkanen, T. Saviauk, and R. Rönkkä: Inkjet printed system-in-package design and manufacturing. Microelectron. J. 39, 1740 (2008).
A. Scandurra, G.F. Indelli, N.G. Sparta, F. Galliano, S. Ravesi, and S. Pignataro: Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics. Surf. Interface Anal. 42, 1163 (2010).
D. Huang, F. Liao, S. Molesa, D. Redinger, and V. Subramanian: Plastic-compatible low resistance printable gold nanoparticle conductors for flexible electronics. J. Electrochem. Soc. 150, G412 (2003).
M. Grouchko, A. Kamyshny, C.F. Mihailescu, D.F. Anghel, and S. Magdassi: Conductive inks with a “built-in” mechanism that enables sintering at room temperature. ACS Nano 5, 3354 (2011).
I. Reinhold, C.E. Hendriks, R. Eckardt, J.M. Kranenburg, J. Perelaer, R.R. Baumann, and U.S. Schubert: Argon plasma sintering of inkjet printed silver tracks on polymer substrates. J. Mater. Chem. 19, 3384 (2009).
M.L. Allen, M. Aronniemi, T. Mattila, A. Alastalo, K. Ojanperä, M. Suhonen, and H. Seppä: Electrical sintering of nanoparticle structures. Nanotechnology 19, 175201 (2008).
J. Leppäniemi, M. Aronniemi, T. Mattila, A. Alastalo, M. Allen, and H. Seppä: Printed WORM memory on a flexible substrate based on rapid electrical sintering of nanoparticles. IEEE Trans. Electron Devices 58, 151 (2011).
K.C. Yung, X. Gu, C.P. Lee, and H.S. Choy: Ink-jet printing and camera flash sintering of silver tracks on different substrates. J. Mater. Process. Technol. 210, 2268 (2010).
H.S. Kim, S.R. Dhage, D.E. Shim, and H.T. Hahn: Intense pulsed light sintering of copper nanoink for printed electronics. Appl. Phys. A 97, 791 (2009).
J. Ryu, H.S. Kim, and H.T. Hahn: Reactive sintering of copper nanoparticles using intense pulsed light for printed electronics. J. Electron. Mater. 40, 42 (2011).
J. Perelaer, B-J. de Gans, and U.S. Schubert: Ink-jet printing and microwave sintering of conductive silver tracks. Adv. Mater. 18, 2101 (2006).
J. Perelaer, M. Klokkenburg, C.E. Hendriks, and U.S. Schubert: Microwave flash sintering of inkjet-printed silver tracks on polymer substrates. Adv. Mater. 21, 4830 (2009).
J. Perelaer, R. Abbel, S. Wünscher, R. Jani, T. van Lammeren, and U.S. Schubert: Roll-to-roll compatible sintering of inkjet printed features by photonic and microwave exposure: From non-conductive ink to 40% bulk silver conductivity in less than 15 seconds. Adv. Mater. 24, 2620 (2012).
J. Perelaer, R. Jani, M. Grouchko, A. Kamyshny, S. Magdassi, and U.S. Schubert: Plasma and microwave flash sintering of a tailored silver nanoparticle ink, yielding 60% bulk conductivity on cost-effective polymer foils. Adv. Mater. 24, 3993 (2012).
S.H. Ko, H. Pan, C.P. Grigoropoulos, C.K. Luscombe, J.M.J. Frechet, and D. Poulikakos: All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology 18, 345202 (2007).
R. Lesyuk, W. Jillek, Y. Bobitski, and B. Kotlyarchuk: Low-energy pulsed laser treatment of silver nanoparticles for interconnects fabrication by ink-jet method. Microelectron. Eng. 88, 318 (2011).
T. Kumpulainen, J. Pekkanen, J. Valkama, J. Laakso, R. Tuokko, and M. Mäntysalo: Low temperature nanoparticle sintering with continuous wave and pulse lasers. Opt. Laser Technol. 43, 570 (2011).
D. Worsley, M. Cherrington, T.C. Claypole, D. Deganello, I. Mabbett, and T. Watson: Ultrafast near-infrared sintering of a slot-die coated nano-silver conducting ink. J. Mater. Chem. 21, 7562 (2011).
D. Tobjörk, H. Aarnio, P. Pulkkinen, R. Bollstrom, A. Maattanen, P. Ihalainen, T. Makela, J. Peltonen, M. Toivakka, H. Tenhu, and R. Osterbacka: IR-sintering of ink-jet printed metal-nanoparticles on paper. Thin Solid Films 520, 2949 (2012).
M.J. Coutts, M.B. Cortie, M.J. Ford, and A.M. McDonagh: Rapid and controllable sintering of gold nanoparticle inks at room temperature using a chemical agent. J. Phys. Chem. C 113, 1325 (2009).
S. Magdassi, M. Grouchko, O. Berezin, and A. Kamyshny: Triggering the sintering of silver nanoparticles at room temperature. ACS Nano 4, 1943 (2010).
S.F. Jahn, T. Blaudeck, R.R. Baumann, A. Jakob, P. Ecorchard, T. Ruffer, H. Lang, and P. Schmidt: Inkjet printing of conductive silver patterns by using the first aqueous particle-free MOD ink without additional stabilizing ligands. Chem. Mater. 22, 3067 (2010).
G.Q. Xie, O. Ohashi, N. Yamaguchi, and A.R. Wang: Effect of surface oxide films on the properties of pulse electric-current sintered metal powders. Metall. Mater. Trans. A 34, 2655 (2003).
J.R. Groza, S.H. Risbud, and K. Yamazaki: Plasma activated sintering of additive-free AlN powders to near-theoretical density in 5 minutes. J. Mater. Res. 7, 2643 (1992).
A.D. Albert, M.F. Becker, J.W. Keto, and D. Kovar: Low temperature, pressure-assisted sintering of nanoparticulate silver films. Acta Mater. 56, 1820 (2008).
M.F.A.M. van Hest, C.J. Curtis, A. Miedaner, R.M. Pasquarelli, T. Kaydanova, P. Hersh and D.S. Ginley: Direct-write contacts: Metallization and contact formation, in 33rd IEEE Photovoltaic Specialists Conference, San Diego, CA, 2008. 04922798.
H.M. Lee, S.Y. Choi, K.T. Kim, J.Y. Yun, D.S. Jung, S.B. Park, and J. Park: A novel solution-stamping process for preparation of a highly conductive aluminum thin film. Adv. Mater. 23, 5524 (2011).
M. Grouchko, A. Kamyshny, and S. Magdassi: Formation of air-stable copper-silver core-shell nanoparticles for inkjet printing. J. Mater. Chem. 19, 3057 (2009).
P.J. Smith and A. Morrin: Reactive inkjet printing. J. Mater. Chem. 22, 10965 (2012).
D.P. Li, D. Sutton, A. Burgess, D. Graham, and P.D. Calvert: Conductive copper and nickel lines via reactive inkjet printing. J. Mater. Chem. 19, 3719 (2009).
Z.K. Kao, Y.H. Hung, and Y.C. Liao: Formation of conductive silver films via inkjet reaction system. J. Mater. Chem. 21, 18799 (2011).
ACKNOWLEDGMENTS
The European Community’s Seventh Framework Programme (FP7/2007-2013) under grant agreement no. 248816 is greatly acknowledged for financial support as well as the Fonds der Chemischen Industrie (FCI) and the Dutch Polymer Institute (DPI, technology area HTE).
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Perelaer, J., Schubert, U.S. Novel approaches for low temperature sintering of inkjet-printed inorganic nanoparticles for roll-to-roll (R2R) applications. Journal of Materials Research 28, 564–573 (2013). https://doi.org/10.1557/jmr.2012.419
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DOI: https://doi.org/10.1557/jmr.2012.419