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References
Zhongbing Luo, Lai Wang, Qinqin Fu, Chongqian Cheng, and Jie Zhao: Formation of interfacial η′-Cu6Sn5 in Sn-0.7Cu/Cu solder joints during isothermal aging. J. Mater. Res. 27, 1468 (2011).
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The online version of the original article can be found at https://doi.org/10.1557/jmr.2011.179
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Luo, Z., Wang, L., Fu, Q. et al. Erratum: Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging. Journal of Materials Research 26, 1742 (2011). https://doi.org/10.1557/jmr.2011.222
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DOI: https://doi.org/10.1557/jmr.2011.222