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Formation of interfacial η’-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging

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An Erratum to this article was published on 01 July 2011

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Abstract

The formation of interfacial η’-Cu6Sn5 in Sn–0.7Cu/Cu solder joints at different aging temperatures was studied using x-ray diffraction (XRD). The time-temperature-formation curve was obtained and is discussed based on the phase transformation from existing η-Cu6Sn5 and interfacial reaction at temperatures below 186 °C. A minimum formation time was observed in the temperature range of 135–150 °C.

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Acknowledgment

The authors thank Prof. J.S. Zhang, Y.N. Wang, F. Ye, and Dr. L.J. Luo for their warm and sincere help.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116085, China

    Zhongbing Luo, Lai Wang, Qinqin Fu, Chongqian Cheng & Jie Zhao

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  1. Zhongbing Luo
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  2. Lai Wang
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  3. Qinqin Fu
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  4. Chongqian Cheng
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  5. Jie Zhao
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Correspondence to Jie Zhao.

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Luo, Z., Wang, L., Fu, Q. et al. Formation of interfacial η’-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging. Journal of Materials Research 26, 1468–1471 (2011). https://doi.org/10.1557/jmr.2011.179

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  • DOI: https://doi.org/10.1557/jmr.2011.179

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