Development of Evaluation Method for Delamination Strength Between Micro-Sized Materials in MEMS Devices

Abstract

Evaluation method for delamination strength of micro-sized materials has been developed using by FEM and measurement of load-displacement curve of micro-sized specimen. This evaluation method is applied to micro-sized cylindrical SU-8 specimens on Si substrate. The maximum shear stress between SU-8 and Si was analyzed with FEM. Fracture load required to delaminate the two materials was examined using a mechanical testing machine for micro-sized materials, which have been developed in our group. The delamination strength was determined from the maximum shear stress and the fracture load.

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Correspondence to Chiemi Ishiyama.

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Ishiyama, C., Hata, J., Koyama, S. et al. Development of Evaluation Method for Delamination Strength Between Micro-Sized Materials in MEMS Devices. MRS Online Proceedings Library 977, 429 (2006). https://doi.org/10.1557/PROC-977-0977-FF04-29

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