Deformation behavior and strain rate sensitivity of nanostructured materials at moderate temperatures

Abstract

Strain-rate jump tests in compression are carried out on nanostructured copper (grain size = 90 nm) at moderate temperatures (353K - 393K). Strain-rate sensitivity m is measured as a function of temperature, T, and strain rate, έ. Increasing temperature or decreasing strain rate induces an increase in the strain-rate sensitivity. For (έ, T) = (1×10-5 s-1, 393K), m is equal to 0.17 which is the highest value reported for nanocrystalline copper. These results of enhanced m are encouraging in terms of gain in ductility. The measurements emphasize the existence of a thermally activated mechanism different from the normal rate-controlling process observed for microcrystalline fcc metals.

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Correspondence to Cécilie Duhamel.

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Duhamel, C., Guérin, S., Hÿtch, M. et al. Deformation behavior and strain rate sensitivity of nanostructured materials at moderate temperatures. MRS Online Proceedings Library 880, 83 (2005). https://doi.org/10.1557/PROC-880-BB8.3

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