Self Assembled Monolayer Methods in the Fabrication of High-Tc Superconductor SNS Junction Nano-Devices

Abstract

Although the superconductor/normal metal (SN) interface is one of the most important controlling factors in determining the performance of superconductor/normal metal/superconductor (SNS) junctions, controlling the SN interface still remains difficult. The in situ deposit techniques have been widely used to cope with this problem, but they limit the types of SNS junctions that can be explored. Soft Chemistry Etching methods were developed to fabricate the YBCO/Au/YBCO and TX-YBCO/Au/TX-YBCO SNS junction nano-devices with ex situ deposit. The planar SNS junctions controlled by such methods exhibited good transport properties above 80 K with less than 10-8ω-cm2 contact resistivity. The current state of the suitable fabrication methods of SNS nano-devices will be described with experiment results.

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Correspondence to Sungwook Kim.

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Kim, S., Chang, I.S., Patel, F. et al. Self Assembled Monolayer Methods in the Fabrication of High-Tc Superconductor SNS Junction Nano-Devices. MRS Online Proceedings Library 872, 74 (2005). https://doi.org/10.1557/PROC-872-J7.4

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