Hot Embossing Lithography: Release Layer Characterization by Chemical Force Microscopy


Hot embossing lithography is a powerful method of replicating three-dimensional micro-and nano-structures (see Figure 1) using a stamp that is pressed into a heat-softened polymer resin. Cooling below the glass-transition temperature (Tg) of the polymer cures the motifs and the stamp and substrate are then separated. Successful replication is therefore contingent on interfacial interactions during the embossing phase and most importantly during the separation or release phase. Various organo- and perfluoro-silane release layers have been proposed and studied.

We have employed variable temperature chemical force microscopy (VT-CFM) using tips silanized with four different SAMs interacting with a thin-film of poly(cyclic olefin), (PCO). The silanized-tip/polymer interaction was studied over a temperature range spanning the Tg of the PCO (∼373 K). Adhesion between a saturated hydrocarbon-decorated tip (OTS) and PCO was comparatively strong (170 nN) 30 K above the Tg of the polymer. Adhesion among the perfluorinated tips was 20 to 50 nN lower at 373 K with a relative increase in perfluoromethyl groups (w/w).

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  1. 1.

    Stephen Y. Chou, Peter R. Krauss, and Preston J. Renstrom, Applied Physics Letters 67, 3114 (1995).

    CAS  Article  Google Scholar 

  2. 2.

    Helge Luesebrink, Thomas Glinsner, Stephen C. Jakeway et al., Journal of Nanoscience and Nanotechnology X (1–5), in press (2005).

  3. 3.

    Gustavo Luengo, Franz-Josef Schmitt, Robert Hill et al., Macromolecules 30, 2482 (1997).

    CAS  Article  Google Scholar 

  4. 4.

    M. M. Alkaisi, R. J. Blaikie, and S. J. McNab, Microelectronic Engineering 57, 367 (2001); Kim Gyu Man, Kim Beomjoon, M. Liebau et al., Journal of Microelectromechanical Systems 11 (3), 175 (2002).

    Article  Google Scholar 

  5. 5.

    Y. Hirai, S. Yoshida, A. Okamoto et al., Journal of Photopolymer Science and Technology 14 (3), 457 (2001).

    CAS  Article  Google Scholar 

  6. 6.

    B.J. Kim, Microelectronic Engineering 57–58, 755 (2001).

    Article  Google Scholar 

  7. 7.

    J. Taniguchi, T. Kawasaki, Y. Tokano et al., Japanese Journal of Applied Physics, Part 41 (6B), 4194 (2002).

  8. 8.

    Abraham Ulman, Introduction to Ultrathin Organic Films: From Langmuir-Blodgett to Self-Assembly. (Academic Press, 1997).

  9. 9.

    So-Jung Park, H. Schift, C. Padeste et al., presented at the MRS, Boston, 2003 (unpublished).

  10. 10.

    Muriel K. Corbierre, Neil S. Cameron, Mark Sutton et al., Langmuir, in press (2005).

  11. 11.

    Muriel K. Corbierre, Neil S. Cameron, and R. Bruce Lennox, Langmuir 20, 2867 (2004).

    CAS  Article  Google Scholar 

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Correspondence to Neil S. Cameron.

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Cameron, N.S., Ott, A., Roberge, H. et al. Hot Embossing Lithography: Release Layer Characterization by Chemical Force Microscopy. MRS Online Proceedings Library 872, 122 (2005).

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