Effect of Temperature on Incubation Time for Spontaneous Morphology Change in Electrodeposited Copper Metallization

Abstract

A systematic investigation of the effect of annealing time and temperature on the incubation period for spontaneous morphology change (SMC) in electrodeposited copper metallization is reported. The incubation time is greatly reduced at higher temperatures. At each temperature, the remaining incubation time at room temperature was found to decrease approximately linearly with increasing annealing time. An Arhennius plot of the measured rates of decrease showed good linearity and yielded a value of 0.48 eV for the activation energy. This is consistent with a vacancy diffusion mechanism for the process occurring during the incubation period and supports our proposed mechanism for SMC.

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References

  1. 1

    W. U. Schmidt, R. C. Alkire and A. A. Gewirth, J.Electrochem. Soc., 143, 3122 (1996)

    CAS  Article  Google Scholar 

  2. 2

    J.M.E. Harper and K.P. Rodbell, J. Vac. Sci. Technol. B15, 763 (1997)

    Article  Google Scholar 

  3. 3

    M. Dietterle, T. Will and D. M. Kolb, Surface Science, 396, 189 (1998)

    CAS  Article  Google Scholar 

  4. 4

    G.R. Stafford, M.D. Vaudin, T.P. Moffat, N. Armstrong, V.D. Jovic and D.R. Kelley, Electrochemical Soc. Proceedings, Vol. 99–34, p. 340 (1999)

    Google Scholar 

  5. 5

    M. Cerisier, K. Attenborough, J. Fransaer, C. V. Haesendonck and J. P. Celis, J.Electrochem. Soc., 146, 2156 (1999)

    CAS  Article  Google Scholar 

  6. 6

    T. Y. B. Leung, M. Kang, B. F. Corry and A. A. Gewirth, J. Electrochem. Soc., 147, 3326 (2000).

    Article  Google Scholar 

  7. 7

    T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford and D. Josell, J.Electrochem. Soc., 147, 4524 (2000).

    CAS  Article  Google Scholar 

  8. 8

    A. A. Rasmussen, J. A. D. Jensen, A. Horsewell and M. A. J. Somers, Electrochim. Acta, 47, 67 (2001)

    CAS  Article  Google Scholar 

  9. 9

    J.W. Patten, E.D. McClanahan, and J.W. Johnston, J. Appl. Phys., 42, 4371 (1971)

    CAS  Article  Google Scholar 

  10. 10

    I.V. Tomov, D.S. Stoychev, and I.B. Vitanova, J. Appl. Electrochem., 15, 887 (1985)

    CAS  Article  Google Scholar 

  11. 11

    D.S. Stoychev, I.V. Tomov, and I.B. Vitanova, J.Appl. Electrochem. 15, 879 (1985)

    Article  Google Scholar 

  12. 12

    T. Titzdorf, L. Craham, S. Jin, C. Mu and D. Fraser, Proc. Int, Interconnect. Technol, Conf. p. 166 (1998)

  13. 13

    C. Lingk and M.E. Gross, J. Appl. Phys., 84, 5547 (1998)

    CAS  Article  Google Scholar 

  14. 14

    M.E. Gross, C. Lingk, T. Siegrist, E. Coleman, W.L. Brown, K. Ueno, Y. Tsuchiya, N. Itoh, T. Ritzdorf, J. Turner, K. Gibbons, E. Klawuhn, M. Biberger, W.Y.C. Lai, J.F. Miner, G. Wu, and F. Zhang, Mat. Res. Soc. Symp. Proc. 514, 293 (1998)

    CAS  Article  Google Scholar 

  15. 15

    J.M.E. Harper, C. Cabral Jr., P.C. Andricacos, L. Gignac, I.C. Noyan, K.P. Rodbell, and C.K. Hu, J. Appl. Phys., 86, 2516, (1999)

    CAS  Article  Google Scholar 

  16. 16

    D. Walther, M.E. Gross, K Evans-Lutterodt, W.L. Brown, M.Oh, S. Merchant and P. Naresh, Mat. Res. Symp. Proc., Vol. 612, p. D10.1.1. (2000)

    Article  Google Scholar 

  17. 17

    S. Lagrange, S.H. Brongersma, M. Judeleiviez, A. Saerens, I Vervoort, E. Richards, B. Palmans and K. Marx, Microelectronic Engineering, 50, 449 (2000)

    CAS  Article  Google Scholar 

  18. 18

    W.H.Teh, L.T. Koh, S.M. Chem, J. Xie, C.Y. Li and P.D. Foo, Microelectronics Journal, 32, 579 (2001)

    CAS  Article  Google Scholar 

  19. 19

    D. N. Buckley and S. Ahmed, Electrochem. Solid State Lett., 6, C33–C37 (2003)

    CAS  Article  Google Scholar 

  20. 20

    S. Ahmed and D.N. Buckley in Proceedings of the Symposium on Copper Interconnects, New Contact Metallurgies and Low-k Interlevel Dielectrics (The Electrochemical Society, Pennington, NJ, 2002).

  21. 21

    R. J. Nichols, E. Bunge, H. Meyer and H. Baumgärtel, Surface Science, 335, 110 (1995).

    CAS  Article  Google Scholar 

  22. 22

    M. Cerisier, C. V. Haesendonck and J. P. Celis, J.Electrochem. Soc., 146, 1829 (1999)

    CAS  Article  Google Scholar 

  23. 23

    S. Ahmed and D. N. Buckley, Abstract No. 163, 205th Meeting of The Electrochemical Society, San Antonio, Texas, May 9–13, 2004

  24. 24

    S. Nakahara, S. Ahmed, and D. N. Buckley, Abstract No. 913, 206th Meeting of The Electrochemical Society, Honolulu, Hawaii, October 3–8, 2004.

  25. 25

    Y. Fujiki, J. Phys. Soc. Japan 14, 1308 (1959).

    CAS  Article  Google Scholar 

  26. 26

    L. Tewordt, Phys. Rev. 109, 61 (1958).

    CAS  Article  Google Scholar 

  27. 27

    H. Kimura, R. Maddin, and D. Kuhlmann-Wilsdorf, Acta Met. 7, 145 (1959).

    CAS  Article  Google Scholar 

  28. 28

    W. Schüle, A. Seeger, D. Schumacher, and K. King, Phys. Stat. Sol. 2, 1199 (1962).

    Article  Google Scholar 

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Ahmed, S., Buckley, D.N., Nakahara, S. et al. Effect of Temperature on Incubation Time for Spontaneous Morphology Change in Electrodeposited Copper Metallization. MRS Online Proceedings Library 863, B5.4 (2004). https://doi.org/10.1557/PROC-863-B5.4

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