Structure Evolution in Plated Cu Films

Abstract

Structure evolution in plated Cu films is a function of sublayer stacking, film thickness, plating chemistry, plating parameters, and temperature. The present work examines grain growth and texture evolution in annealed plated Cu on a 25 nm thick Ta sublayer for films of 480 and 750 nm in thickness. These results are compared against those obtained from damascene Cu lines fabricated from a similar process, using a series of line widths. The results show that the initial structures of the plated films are similar, with slightly weaker (111) texture, a higher fraction of twin boundaries, and larger grains in the thicker films. The microstructure of the Cu within the trench constraints is a strong function of line geometry with the propensity for twin boundary development controlling structural evolution.

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References

  1. 1

    M.T. Perez-Prado, and J.J. Vlassak, Scripta Mater., 47 (2002) p.817.

    CAS  Article  Google Scholar 

  2. 2

    J. Koike, M. Wada, M. Sanada, and K. Maruyama, Appl. Phys. Lett., 81 (2002) p.1017.

    CAS  Article  Google Scholar 

  3. 3

    A. Sekiguchi, J. Koike, and K. Maruyama, Appl. Phys. Lett., 83 (2003) p.1962.

    CAS  Article  Google Scholar 

  4. 4

    A. Sekiguchi, J. Koike, S. Kamiya, M. Saka, and K. Maruyama, Appl. Phys. Lett., 79 (2001) p.1264.

    CAS  Article  Google Scholar 

  5. 5

    K. Abe, Y. Harada, M. Yoshimaru, and H. Onoda, J. Vac. Sci. Technol., B 22 (2004) p.721.

    Article  Google Scholar 

  6. 6

    C. Ryu, A.L.S. Loke, T. Nogami, and S.S. Wong, Proc. IEEE Int. Reliability Physics Symp., (1997) p.201.

  7. 7

    L. Vanasupa, Y.-C. Joo, P. R. Besser, and S. Pramanick, J. Appl. Phys., 85 (1999) p.2583.

    CAS  Article  Google Scholar 

  8. 8

    Y. Ji, T. Zhong, Z. Li, X. Wang, D. Luo, and Y. Xia, Z. Liu, Microelectronic Engineering, 71 (2004) p.182.

    CAS  Article  Google Scholar 

  9. 9

    C.V. Thompson, Annual Review of Materials Science, 20 (1990) p.245.

    CAS  Article  Google Scholar 

  10. 10

    K.-W. Kwon, C. Ryu, R. Sinclair, and S.S. Wong, Appl. Phys. Lett, 71 (1997) p.3069.

    CAS  Article  Google Scholar 

  11. 11

    D.P. Field, O.V. Kononenko, and V.N. Mateev, J. Electr. Mat, 31 (2002) p.40.

    Article  Google Scholar 

  12. 12

    P.R. Besser, E. Zschech, W. Blum, D. Winter, R. Ortega, S. Rose, M. Herrick, M. Gall, S. Thrasher, M. Tiner, B. Baker, G. Braeckelmann, L. Zhao, C. Simpson, C. Capasso, H. Kawasaki, and E. Weitzman, Journal of Electronic Materials 30 (2001) p.320.

    CAS  Article  Google Scholar 

  13. 13

    T. Muppidi, D.P. Field, J.E. Sanchez, Jr, and C. Woo, Thin Solid Films 471 (2005) p. 63.

    CAS  Article  Google Scholar 

  14. 14

    N.-J. Park, DP Field, MM Nowell, and PR Besser, J. Electronic Matls, (2005) to be published.

  15. 15

    E.M. Zielinski, R.P. Vinci and J.C. Bravman, J. Appl. Phys, Vol. 76, (1994), p. 4516.

    CAS  Article  Google Scholar 

  16. 16

    F.J. Humphreys, Y. Huang, I. Brough, and C. Harris, J. Microscopy, Vol. 195 (1999), p. 212.

    CAS  Article  Google Scholar 

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Correspondence to D. P. Field.

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Field, D.P., Park, N., Besser, P. et al. Structure Evolution in Plated Cu Films. MRS Online Proceedings Library 863, B5.2 (2004). https://doi.org/10.1557/PROC-863-B5.2

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