Abstract
Ta films were prepared in the metastable β phase using an ultra-high vacuum sputter deposition system. The stresses that arose during thermal cycles to 750°C were measured using an in situ substrate curvature measurement system, allowing oxygen content in the films to be minimized. A phase transformation from β to the stable α phase takes place in conjunction with distinct “jumps” in stress in the tensile direction during heating at approximately 400°C and 650°C. X-ray and electron backscatter diffraction (EBSD) analyses were used to determine grain sizes, along with crystal phase and orientation information. These results indicate a significant amount of grain growth accompanying the phase transformation. It is found that the measured total stress change is in reasonable agreement with that predicted by the combination of grain growth, crystal densification associated with the phase transformation, and stress relaxation.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
K. Ino, T. Shinohara, T. Ushiki, and T. Ohmi, J. Vac. Sci. Technol. A 15, 2627 (1997).
P. Catania, R.A. Roy, and J.J. Cuomo, J. Appl. Phys. 74, 1008 (1993).
R. Hoogeveen, M. Moske, H. Geisler, and K. Samwer, Thin Solid Films 275, 203 (1996).
L.G. Feinstein and R.D. Huttemann, Thin Solid Films 16, 129 (1973).
W.D. Westwood and F.C. Livermore, Thin Solid Films 5, 407 (1970).
K. Kondo, M. Nakabayashi, K. Kawakami, T. Chijimatsu, M. Nakaishi, M. Yamada, M. Yamabe, and K. Sugishima, J. Vac. Sci. Technol. A 11, 3067 (1993).
C. Cabral, Jr., L.A. Clevenger, and R.G. Schad, J. Vac. Sci. Technol. B 12, 2818 (1994).
L.A. Clevenger, A. Mutscheller, J.M.E. Harper, C. Cabral, Jr., and K. Barmak, J. Appl. Phys. 72, 4918 (1992).
D.S. Wuu, C.C. Chan, R.H. Horng, W.C. Lin, S.L. Chiu, and Y.Y. Wu, Applied Surface Science 144–145, 315 (1999).
D.S. Wuu, M.L. Lee, and T.Y. Lin, Applied Surface Science 92, 626 (1996).
L. Liu, H. Gong, Y. Wang, J. Wang, A.T.S. Wee, and R. Liu, Materials Science and Engineering C 16, 85 (2001).
J.B. Shu, Ph.D. Dissertation, Cornell University, Ithaca, NY (2003).
G. Stoney, Proceedings of the Royal Society of London A82, 172 (1909).
K. Jackson, R. Knepper, and S.P. Baker, (unpublished).
A. Jiang, A. Yohannan, N.O. Nnolim, T.A. Tyson, L. Axe, S.L. Lee, and P. Cote, Thin Solid Films 437, 116 (2003).
P.T. Mosely and C.J. Seabrook, Acta Cryst. B29 1170 (1973).
L.C. Feldman and J.W. Mayer, Fundamentals of Surface and Thin Film Analysis (Prentice Hall, Upper Saddle, NJ, 1986).
Acknowledgments
The authors would like to thank Jonathan Shu for assistance with the UHV system. This work made use of the x-ray, electron microscopy, and ion beam facilities of the Cornell Center for Materials Research (CCMR) with support from the National Science Foundation Materials Research Science and Engineering Centers (MRSEC) program (DMR-0079992). This work was supported by U.S. Department of Education GAANN Fellowship (award P200A000800-02), National Science Foundation CAREER award (DMR-9875119), and by Cornell University.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Knepper, R., Jackson, K., Stevens, B. et al. Thermomechanical behavior and microstructural evolution in tantalum thin films. MRS Online Proceedings Library 854, U6.8 (2004). https://doi.org/10.1557/PROC-854-U6.8
Published:
DOI: https://doi.org/10.1557/PROC-854-U6.8