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Stability and Structural Transition of Gold Nanowires under Their Own Surface Stresses

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Abstract

First-principle, tight binding, and semi-empirical embedded atom calculations are used to investigate a tetragonal phase transformation in gold nanowires. As wire diameter is decreased, tight binding and modified embedded atom simulations predict a surface-stress-induced phase transformation from a face-centered-cubic (fcc) <100> nanowire into a body-centered-tetragonal (bct) nanowire. In bulk gold, all theoretical approaches predict a local energy minimum at the bct phase, but tight binding and first principle calculations predict elastic instability of the bulk bct phase. The predicted existence of the stable bct phase in the nanowires is thus attributed to constraint from surface stresses. The results demonstrate that surface stresses are theoretically capable of inducing phase transformation and subsequent phase stability in nanometer scale metallic wires under appropriate conditions.

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Acknowledgments

The work of KG, JD, and MLD is supported by Sandia National Laboratories, NSF, and DOE. The work of MH, NB, and MM was supported by ONR. Computer programs developed under the Department of Defense CHSSI program of the High Perfomance Computation Modernization Project (HCMCP) were utilized as well as the VASP code available at its facilities.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO, 80309, USA

    Ken Gall, Jiankuai Diao & Martin L. Dunn

  2. Center for Computational Materials Science, Naval Research Laboratory, Washington, D.C., 20375, USA

    Michael Haftel, Noam Bernstein & Michael J. Mehl

Authors
  1. Ken Gall
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  2. Michael Haftel
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  3. Jiankuai Diao
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  4. Martin L. Dunn
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  5. Noam Bernstein
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  6. Michael J. Mehl
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Correspondence to Jiankuai Diao.

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Gall, K., Haftel, M., Diao, J. et al. Stability and Structural Transition of Gold Nanowires under Their Own Surface Stresses. MRS Online Proceedings Library 854, U5.7 (2004). https://doi.org/10.1557/PROC-854-U5.7

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