Direct Measurements of Fracture Toughness and Crack Growth in Polysilicon MEMS

Abstract

Direct measurements of Mode-I critical stress intensity factor and crack tip displacements were conducted in the vicinity of atomically sharp edge cracks in polycrystalline silicon MEMS using our in situ Atomic Force Microscopy (AFM)/Digital Image Correlation (DIC) method. The average Mode-I critical stress intensity factor for various fabrication runs was 1.00 ±0.1 MPaw. The experimental crack tip displacement fields were in very good agreement with linear elastic fracture mechanics solutions. By means of an AFM, direct experimental evidence of incremental crack growth in polycrystalline silicon was obtained for the first time via spatially resolved crack growth measurements. The incremental crack growth in brittle polysilicon is attributed to its locally anisotropic polycrystalline structure which also results in different local and macroscopic (apparent) stress intensity factors.

This is a preview of subscription content, access via your institution.

References

  1. [1]

    R. Ballarini, R. L. Mullen, A.H. Heuer, Int. Journal of Fracture 95, pp. 19–39, (1999).

    Article  Google Scholar 

  2. [2]

    K. Abdel-Tawab, G.J. Rodin, Int. J. Fracture 24, 1–13, (1998).

    Google Scholar 

  3. [3]

    H. Kahn, R. Ballarini, A.H. Heuer, Proceedings of the MRS 657, pp. 13–18, (2001).

    Google Scholar 

  4. [4]

    W.N. Sharpe, B. Yuan, R.L. Edwards, Proceedings of the MRS 505, pp. 51–56, (1997).

    Article  Google Scholar 

  5. [5]

    T. Tsuchiya, J. Sakata, Y. Taga, Proceedings of the MRS 505, pp. 285–290, (1998).

    Article  CAS  Google Scholar 

  6. [6]

    H. Kahn, R. Ballarini and A.H. Heuer, Proceedings of the MRS 657, pp. 13–18, (2001).

    Google Scholar 

  7. [7]

    C. Keller, MEMS Precision Instruments, El Cerrito, CA, pp. 185–202, (1998).

    Google Scholar 

  8. [8]

    I. Chasiotis, W.G. Knauss, SPIE Proceedings 3512, pp. 66–75, Santa Clara, CA, (1998).

    Article  CAS  Google Scholar 

  9. [9]

    I. Chasiotis, W.G. Knauss, Experimental Mechanics 42, pp. 51–57, (2002).

    Article  CAS  Google Scholar 

  10. [10]

    I. Chasiotis, S.W. Cho, K. Jonnalagadda, A. McCarty, Proceedings of the Society for Experimental Mechanics, pp. 37–45, X International Congress, Costa Mesa, CA, pp. 37–45, (2004).

    Google Scholar 

  11. [11]

    I. Chasiotis, IEEE Trans. of Devices, Materials, and Reliability 4 (2), pp. 176–188, (2004).

    CAS  Google Scholar 

  12. [12]

    I. Chasiotis, W.G. Knauss, SPIE Proceedings 4175, pp. 96–103, (2000).

    Article  CAS  Google Scholar 

  13. [13]

    H. Tada, P.C. Paris, G.R. Irwin, The Stress Analysis of Cracks Handbook, pp. 52–53, 3rd Edition, ASME Press, (2000).

    Google Scholar 

  14. [14]

    R. Pérez, P. Gumbsch, Acta Mater. Met. 48, pp. 4517, (2000).

    Article  Google Scholar 

  15. [15]

    S. Cho, J.F. Cárdenas-García, and I. Chasiotis, accepted in Sensors and Actuators A (2004).

Download references

Acknowledgments

The authors gratefully acknowledge the support provided by the Air Force Office of Scientific Research (AFOSR) through grant F49620-03-1-0080 with Dr. B.L. Lee as monitor.

Author information

Affiliations

Authors

Corresponding author

Correspondence to I. Chasiotis.

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Chasiotis, I., Cho, S. & Jonnalagadda, K. Direct Measurements of Fracture Toughness and Crack Growth in Polysilicon MEMS. MRS Online Proceedings Library 854, U10.6 (2004). https://doi.org/10.1557/PROC-854-U10.6

Download citation