Direct measurements of Mode-I critical stress intensity factor and crack tip displacements were conducted in the vicinity of atomically sharp edge cracks in polycrystalline silicon MEMS using our in situ Atomic Force Microscopy (AFM)/Digital Image Correlation (DIC) method. The average Mode-I critical stress intensity factor for various fabrication runs was 1.00 ±0.1 MPaw. The experimental crack tip displacement fields were in very good agreement with linear elastic fracture mechanics solutions. By means of an AFM, direct experimental evidence of incremental crack growth in polycrystalline silicon was obtained for the first time via spatially resolved crack growth measurements. The incremental crack growth in brittle polysilicon is attributed to its locally anisotropic polycrystalline structure which also results in different local and macroscopic (apparent) stress intensity factors.
This is a preview of subscription content, access via your institution.
Buy single article
Instant access to the full article PDF.
Tax calculation will be finalised during checkout.
R. Ballarini, R. L. Mullen, A.H. Heuer, Int. Journal of Fracture 95, pp. 19–39, (1999).
K. Abdel-Tawab, G.J. Rodin, Int. J. Fracture 24, 1–13, (1998).
H. Kahn, R. Ballarini, A.H. Heuer, Proceedings of the MRS 657, pp. 13–18, (2001).
W.N. Sharpe, B. Yuan, R.L. Edwards, Proceedings of the MRS 505, pp. 51–56, (1997).
T. Tsuchiya, J. Sakata, Y. Taga, Proceedings of the MRS 505, pp. 285–290, (1998).
H. Kahn, R. Ballarini and A.H. Heuer, Proceedings of the MRS 657, pp. 13–18, (2001).
C. Keller, MEMS Precision Instruments, El Cerrito, CA, pp. 185–202, (1998).
I. Chasiotis, W.G. Knauss, SPIE Proceedings 3512, pp. 66–75, Santa Clara, CA, (1998).
I. Chasiotis, W.G. Knauss, Experimental Mechanics 42, pp. 51–57, (2002).
I. Chasiotis, S.W. Cho, K. Jonnalagadda, A. McCarty, Proceedings of the Society for Experimental Mechanics, pp. 37–45, X International Congress, Costa Mesa, CA, pp. 37–45, (2004).
I. Chasiotis, IEEE Trans. of Devices, Materials, and Reliability 4 (2), pp. 176–188, (2004).
I. Chasiotis, W.G. Knauss, SPIE Proceedings 4175, pp. 96–103, (2000).
H. Tada, P.C. Paris, G.R. Irwin, The Stress Analysis of Cracks Handbook, pp. 52–53, 3rd Edition, ASME Press, (2000).
R. Pérez, P. Gumbsch, Acta Mater. Met. 48, pp. 4517, (2000).
S. Cho, J.F. Cárdenas-García, and I. Chasiotis, accepted in Sensors and Actuators A (2004).
The authors gratefully acknowledge the support provided by the Air Force Office of Scientific Research (AFOSR) through grant F49620-03-1-0080 with Dr. B.L. Lee as monitor.
About this article
Cite this article
Chasiotis, I., Cho, S. & Jonnalagadda, K. Direct Measurements of Fracture Toughness and Crack Growth in Polysilicon MEMS. MRS Online Proceedings Library 854, U10.6 (2004). https://doi.org/10.1557/PROC-854-U10.6