Abstract
We present an integrated Monte Carlo implant simulator which is capable of accurately simulating ion implantation into any amorphous materials and crystalline Si for 1D/2D/3D structures with arbitrary geometry and topography. With this simulator, we investigate some practical examples which reveal interesting 2D/3D effects, and demonstrate the importance of <110> channeling for sub-100nm silicon technology.
This is a preview of subscription content, access via your institution.
References
- [1]
B. Obradovic, G. Wang, Y. Chen, D. Li, C. Snell, and A. F. Tasch, UT-MARLOWE 5.0 with TOMCAT. The University of Texas at Austin, Austin, Texas, 1999.
- [2]
G. Hobler, A. Simionescu, L. Palmetshofer, C. Tian, and G. Stingeder, J. Appl. Phys. 77, 3697 (1995).
- [3]
M. Posselt, Rad. Effs. and Defs. in Solids 130–131, 87 (1994).
- [4]
B. Schmidt, M. Posselt, N. Strecker, and T. Feudel, Comp. Mat. Sci. 11, 87 (1998).
- [5]
D. Li, L. Lin, G. Wang, Y. Chen, G. Shrivastav, S. Oak, A. F. Tasch, S. K. Banerjee, IEDM Tech. Dig., pp. 38.6.1–4, 2001.
- [6]
A. Hoessinger, PhD thesis, Technical University Vienna, 2000.
- [7]
J. O. Borland, V. Moroz, H. Wang, W. Maszara, and H. Iwai, Solid State Technol., p. 52, June 2003.
- [8]
Synopsys, Inc., Mountain View, CA, Taurus Process Reference Manual, December 2003.
- [9]
S. Tian, J. Appl. Phys. 93, 5893 (2003). S. Tian, Nucl. Instr. Meth. Phys. Res. B 215, 403 (2004).
- [10]
S.-H. Yang, D. Lim, S. J. Morris, and A. F. Tasch, Nucl. Instr. Meth. Phys. Res. B 102, 242 (1995).
- [11]
W. Bohmayr, A. Burenkov, J. Lorenz, H. Ryssel, and S. Selberherr, IEEE Trans. Semicond. Manu. 8, 402 (1995).
- [12]
K. M. Beardmore and N. Grønbech-Jensen, Nucl. Instr. Meth. Phys. Res. B 153, 391 (1999).
Author information
Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Tian, S., Moroz, V. & Strecker, N. Accurate Monte Carlo Simulation of Ion Implantation into Arbitrary 1D/2D/3D Structures for Silicon Technology. MRS Online Proceedings Library 810, 316–321 (2003). https://doi.org/10.1557/PROC-810-C6.5
Published:
Issue Date: