Next generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (2.0-2.4), high thermal stability (degradation temperature higher than 400°C), high glass transition temperature (greater than 350°C), low water uptake (less than one percent), solubility in selected organic solvents, and low thermal expansion are all required. We have successfully synthesized and characterized several candidate polymers in an effort to address these needs.
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T.D. Dang, P.T. Mather, M.D. Alexander Jr., C.J. Grayson, M.D. Houtz, R.J. Spry, F.E. Arnold, J Poly. Sci. Part A: Poly Chem, 38 1991 (2000)
Thuy Dang, Leslie S. Hudson, William A. Feld, and Fred E. Arnold, Polymer Preprints 41(1), 103 (2000)
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Alexander, M.D., Dang, T.D., Specker, C.E. et al. High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging. MRS Online Proceedings Library 682, 66 (2001). https://doi.org/10.1557/PROC-682-N6.6