High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging

MRS Online Proceedings Library volume 682, Article number: 66 (2001) Cite this article

Abstract

Next generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (2.0-2.4), high thermal stability (degradation temperature higher than 400°C), high glass transition temperature (greater than 350°C), low water uptake (less than one percent), solubility in selected organic solvents, and low thermal expansion are all required. We have successfully synthesized and characterized several candidate polymers in an effort to address these needs.

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References

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    T.D. Dang, P.T. Mather, M.D. Alexander Jr., C.J. Grayson, M.D. Houtz, R.J. Spry, F.E. Arnold, J Poly. Sci. Part A: Poly Chem, 38 1991 (2000)

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Affiliations

  1. Polymer Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory Wright-Patterson Air Force Base, Ohio, 45433-7750, USA

    Max D. Alexander Jr., Thuy D. Dang, Christina E. Specker, Marlene Houtz, R. J. Spry & Fred E. Arnold

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  1. Max D. Alexander Jr.
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  2. Thuy D. Dang
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  3. Christina E. Specker
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  4. Marlene Houtz
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  5. R. J. Spry
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  6. Fred E. Arnold
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Correspondence to Max D. Alexander Jr..

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Alexander, M.D., Dang, T.D., Specker, C.E. et al. High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging. MRS Online Proceedings Library 682, 66 (2001). https://doi.org/10.1557/PROC-682-N6.6

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