Abstract
Low-loped p-type silicon carbide buffer layers are grown by chemical vapor deposition on conducting and semi-insulating substrates. Capacitance-voltage and electrical admittance techniques are developed for accurate non-destructive characterization. The electrical admittance techniques suggested are capable of measuring the resistivity in a very wide range, up to 7 orders of magnitude. MESFET devices using thick buffer layers on conducting substrates are reported with Ft=8.4 GHz and Fmax=32 GHz.
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References
- 1.
J.W. Palmour, C.E. Weitzel, K.J. Nordquist and C.H. Carter, IOP Conf. Ser. 137, 495 (1994).
- 2.
S.T. Allen, R.A. Sadler, T.S. Alcorn, J. Sumakeris, R.C. Glass, C.H. Carter, and J W. Palmour, Materials Science Forum 264–268, 953 (1998).
- 3.
O. Noblanc, C. Arnodo, E. Chartier and C. Brylinski, Materials Science Forum 264–268, 949 (1998)
- 4.
Epigress AB, Ideon Science Park, S-223 70 Lund, Sweden.
- 5.
C.E. Weitzel, Materials Science Forum 264–268, 909 (1998).
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Konstantinov, A.O., Karlsson, S., Nilsson, P.Å. et al. Characterization of P-Type Buffer Layers for SiC Microwave Device Applications. MRS Online Proceedings Library 572, 197 (1999). https://doi.org/10.1557/PROC-572-197
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