Stress Evolution during Thermoset Cure

Abstract

The residual stress evolution in an epoxy during isothermal curing process has been determined experimentally. It was found that for a certain curing temperature range in which the characteristic time for the molecular motions leading to volume recovery is shorter than the time scale of the experiment, an incremental elastic constitutive equation can be used to describe the mechanical response of the epoxy. It was also found that appreciable residual stresses are developed in a threedimensionally constrained epoxy resin system within the rubbery state.

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Mei, Y., Yee, A.F., Wineman, A.S. et al. Stress Evolution during Thermoset Cure. MRS Online Proceedings Library 515, 195–202 (1998). https://doi.org/10.1557/PROC-515-195

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