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Stress Evolution during Thermoset Cure

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Abstract

The residual stress evolution in an epoxy during isothermal curing process has been determined experimentally. It was found that for a certain curing temperature range in which the characteristic time for the molecular motions leading to volume recovery is shorter than the time scale of the experiment, an incremental elastic constitutive equation can be used to describe the mechanical response of the epoxy. It was also found that appreciable residual stresses are developed in a threedimensionally constrained epoxy resin system within the rubbery state.

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References

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Authors and Affiliations

  1. Department of Mechanical Engineering and Applied Mechanics, The University of Michigan, 2250 G.G. Brown, 2350 Hayward St., Ann Arbor, MI, 48109-2125, USA

    Yuhai Mei & Alan S. Wineman

  2. Department of Materials Science and Engineering, The University of Michigan, Ann Arbor, MI, 48109-2136, USA

    Albert F. Yee

  3. National Starch and Chemical Company, 10 Finderne Ave, Bridgewater, NJ, 08807, USA

    Chaodong Xia

Authors
  1. Yuhai Mei
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  2. Albert F. Yee
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  3. Alan S. Wineman
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  4. Chaodong Xia
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Mei, Y., Yee, A.F., Wineman, A.S. et al. Stress Evolution during Thermoset Cure. MRS Online Proceedings Library 515, 195–202 (1998). https://doi.org/10.1557/PROC-515-195

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  • DOI: https://doi.org/10.1557/PROC-515-195

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