Whole-field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages


Features and recent developments of various photomechanics methods are reviewed for thermal deformation analyses of electronic packages. Applications to diverse problems are illustrated to demonstrate wide applicability of the methods. The whole-field displacement information, with various sensitivity and resolution scales, is ideally suited for the deformation study of a broad range of problems in deformation analyses of electronic packaging. The methods are mature and they can be practiced routinely. A more extensive range of applications are anticipated.

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Han, B. Whole-field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages. MRS Online Proceedings Library 515, 167–179 (1998). https://doi.org/10.1557/PROC-515-167

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