Whole-field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages

Abstract

Features and recent developments of various photomechanics methods are reviewed for thermal deformation analyses of electronic packages. Applications to diverse problems are illustrated to demonstrate wide applicability of the methods. The whole-field displacement information, with various sensitivity and resolution scales, is ideally suited for the deformation study of a broad range of problems in deformation analyses of electronic packaging. The methods are mature and they can be practiced routinely. A more extensive range of applications are anticipated.

This is a preview of subscription content, access via your institution.

References

  1. 1.

    A. S. Kobayashi, ed., “Handbook on Experimental Mechanics”, Prentice-Hall, Englewood Cliffs, NJ, 1987.

    Google Scholar 

  2. 2.

    D. Post, B. Han, P. Ifju, “High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials”, Springer-Verlag, NY, 1994.

    Google Scholar 

  3. 3.

    Y. Guo, C. K. Lim, W. T. Chen, C. G. and B. Woychik, “Solder Ball Connect (SBC) Assemblies under Thermal Loading: I. Deformation Measurement via Moiré Interferometry, and Its Interpretation”, IBM Journal of Research and Development, Vol. 37, No.5, pp. 635–648, 1993.

    Article  Google Scholar 

  4. 4.

    Han and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry”, Journal of Electronic Packaging, Transaction of ASME, Vol. 117, pp. 185–191, 1995.

    Article  Google Scholar 

  5. 5.

    B. Han and Y. Guo, “Determination of Effective Co of Thermal Expansion of Electronic Packaging Components: A Whole-field Approach”, IEEE Transactions on Components, Packaging and Manufacturing Technology-Part A, Vol. 19, No.2, pp. 240–247, 1996.

    Article  Google Scholar 

  6. 6.

    B. Han, “Deformation Mechanism of Two-Phase Solder Column Interconnections under Highly Accelerated Thermal Cycling Condition: An Experimental Study”, Journal of Electronic Packaging, Transaction of the ASME, Vol. 119, pp. 189–196, 1997.

    Article  Google Scholar 

  7. 7.

    B. Han, Y. Guo, C. K. Lim and D. Caletka, “Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods”, Journal of Electronic Packaging, Transaction of the ASME, Vol. 118, pp. 157–163, 1996.

    Article  Google Scholar 

  8. 8.

    P. Beckmann and A. Spizzichino, The Scattering of Electromagnetic Wave from Rough Surface, New York: Macmillan, 1963.

    Google Scholar 

  9. 9.

    C. R. Munnerlyn and M. Latta, “Rough Surface Interferometry Using CO2 Laser Source”, Applied Optics, Vol. 7, No.9, pp. 1858–1859, 1968.

    CAS  Article  Google Scholar 

  10. 10.

    O. Kwon, J. C. Wyant and C. R. Hayslett, “Rough Surface Interferometry at 10.6 μm”, Applied Optics, Vol. 19, No.11, pp. 1862–1869, 1980.

    CAS  Article  Google Scholar 

  11. 11.

    J. Sinha and H. Tippur, “Infrared Interferometry for Rough Surface Measurements: Application to Failure Characterization and Flaw Detection”, Optical Engineering, Vol. 38, No.8, pp. 2233-2239.

  12. 12.

    K. Verma, D. Columbus, B. Han and B. Chandran, “Real-time Warpage Measurement of Electronic Components with Variable Sensitivity,” Proceedings of 1998 ECTC, Seattle Washington, May 1998.

    Google Scholar 

  13. 13.

    B. Han and Y. Guo, “Photomechanics Tools as Applied to Electronic Packaging Product Development,” B. Han, R. Mahajan and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 1, pp. 11–15, Society for Experimental Mechanics, Bethel, CT, 1997.

    Google Scholar 

Download references

Author information

Affiliations

Authors

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Han, B. Whole-field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages. MRS Online Proceedings Library 515, 167–179 (1998). https://doi.org/10.1557/PROC-515-167

Download citation