Damage Evolution and Mechanical Failure in Flip-chip Interconnects

Abstract

The analysis of the mechanical behaviour of flip-chip interconections is an essential aspect of the reliability of the devices using this technique. When manufacturing them and during their operation, the interconective systems are submitted to thermal and mechanically induced stresses. By cyclic micromechanical testing and from analysis by micro Raman of singularities, we studied the mechanical response and the failure of samples, consisting of a substrate, the interconections and a chip.

Two sort of low melting point alloys were investigated, with different metallurgies for the pads, holding the interconections.

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Soperm, A., De Wolf, I., Pozza, G. et al. Damage Evolution and Mechanical Failure in Flip-chip Interconnects. MRS Online Proceedings Library 515, 105–110 (1998). https://doi.org/10.1557/PROC-515-105

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