The Influence of Thermal-Mechanical Effectson Resistance Changes During and After Electromigration Experiments

MRS Online Proceedings Library volume 391, Article number: 513 (1995) Cite this article

Abstract

This paper is focused on the non-linear resistance behaviours often detected by means of high resolution resistometric methods both at the very beginning of an electromigration (EM) test, and after the high stressing current inducing EM is switched off. It is shown that temperature steps, always present at the beginning or after EM, are the triggering events for different, often reversible, physical phenomena contributing to resistance changes. Precipitation-dissolution of alloyed elements is perhaps the most important one, while other mechanisms, like the combined effect of hydrostatic stress relaxation and void volume change, should cancel out. These effects, however, don’t exclude a possible simultaneous effect on the resistance of accumulation/relaxation of EM damage. Experimental results are collected by means of different, complementary techniques.

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References

  1. 1

    J. R. Lloyd, R. H. Koch, Proc. 25th IEEE Int. Rel. Phys. Symp., 161 (1987)

    Google Scholar 

  2. 2

    G. L. Baldini, A. Scorzoni, IEEE Trans, on Electron Devices, 38 (3), 469 (1991).

    CAS  Article  Google Scholar 

  3. 3

    V. D’Haeger, H. Stulens, W. De Ceuninck, L. De Schepper, G. Gallopyn, P. De Pauw, L. M. Stals, ESREF ‘93, Bordeaux (France), 141 (1993).

  4. 4

    A. Scorzoni, I. De Munari, H. Stulens, Mat. Res. Symp. Proc., 337, 515 (1994).

    CAS  Article  Google Scholar 

  5. 5

    A. Scorzoni, G. C. Cardinali, G. L. Baldini, G. Soncini, Microelectron. Reliab., 30, 123 (1990).

    Article  Google Scholar 

  6. 6

    G. L. Baldini, A. Scorzoni, F. Tamarri, Microelectron. Reliab., 33, 1841 (1993).

    Article  Google Scholar 

  7. 7

    J. Niehof, P. A. Flinn, T. J. Maloney, ESREF ‘92, Schwäbisch Gmünd (Germany), 359 (1992).

  8. 8

    U. E. Möckl, J. R. Lloyd and E. Arzt, Mat. Res. Symp. Proc., 309, 301 (1993).

    Article  Google Scholar 

  9. 9

    J. Niehof, H. C. de Graaf, J. F. Verwey, ESREF ‘93, Bordeaux (France), 135 (1993).

  10. 10

    K. Hinode, T. Furusawa, Y. Homma, Proc. 30th IEEE Int. Rel. Phys. Symp., 205 (1992).

    Google Scholar 

  11. 11

    J. E. Sanchez, Jr., V. Pham, Mat. Res. Symp. Proc., 338, 459 (1994).

    CAS  Article  Google Scholar 

  12. 12

    A. W. Lawson, Prog, in Metal Phys., 6, 1 (1956).

    CAS  Article  Google Scholar 

  13. 13

    M. A. Korhonen, P. Børgesen, K. N. Tu, Che-Yu Li, J. Appl. Phys., 73 (8), 3790 (1993).

    CAS  Article  Google Scholar 

  14. 14

    M. A. Korhonen, P. Børgesen, D. D. Brown, Che-Yu Li, J. Appl. Phys., 74 (8), 4995 (1993).

    CAS  Article  Google Scholar 

  15. 15

    G. J. Van Gurp, J. Appl. Phys., 44 (5), 2040 (1973).

    Article  Google Scholar 

  16. 16

    I. De Munari, A. Scorzoni, F. Tamarri, D. Govoni, F. Corticelli and F. Fantini, IEEE Trans. on Electron Devices, 41 (12), 2276 (1994).

    CAS  Article  Google Scholar 

  17. 17

    J. H. Rose, J. R. Lloyd, A. Shepela, N. Riel, Proc 49th Ann. Meet. Electron Microscopy Soc. of America, 820(1991).

    Google Scholar 

  18. 18

    A. Tezaki, T. Mineta, H. Egawa, T. Noguchi, Proc. 28th IEEE Int. Rel. Phys. Symp., 221 (1990).

    Google Scholar 

  19. 19

    M. A. Korhonen, W. R. LaFontaine, P. Børgesen, Che-Yu Li, J. Appl. Phys., 70 (11), 6774 (1991).

    CAS  Article  Google Scholar 

  20. 20

    P. R. Besser, T. N. Marieb, J. C. Bravman, P. A. Flinn, Mat. Res. Symp. Proc., 338, 275 (1994).

    CAS  Article  Google Scholar 

  21. 21

    I.-S. Yeo, S. G. H. Anderson, C.-N. Liao, D. Jawarani, H. Kawasaki, P. S. Ho, Mat. Res. Symp. Proc., 338, 281 (1994).

    CAS  Article  Google Scholar 

  22. 22

    M. Genut, Z. Li, C. L. Bauer, S. Mahajan, P. F. Tang, A. G. Milnes, Appl. Phys. Lett., 58 (21), 2354 (1991).

    CAS  Article  Google Scholar 

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Affiliations

  1. CNR - Istituto LAMEL, Bologna, via P. Gobetti 101, 40129, Italy

    A. Scorzoni

  2. Dip. Ingegneria dell’Informazione, Università di Parma, v.le delle Scienze, Parma, 43100, Italy

    I. De Munari

  3. Material Physics Division, Institute for Material Research (IMO),Limburg University Centre, Diepenbeek, B-3590, Belgium

    H. Stulens & V. D’haeger

Authors
  1. A. Scorzoni
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  2. I. De Munari
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  3. H. Stulens
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  4. V. D’haeger
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Scorzoni, A., De Munari, I., Stulens, H. et al. The Influence of Thermal-Mechanical Effectson Resistance Changes During and After Electromigration Experiments. MRS Online Proceedings Library 391, 513 (1995). https://doi.org/10.1557/PROC-391-513

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