Effects of Interlayers on the Scratch Adhesion Performance of Ultra-Thin Films of Copper and Gold on Silicon Substrates

Abstract

Scratch testing has long been used to assess the adhesion of a film to its substrate. As film thicknesses have decreased, the need for greater precision and sensitivity in the scratch testing apparatus has increased. To this end, a nanoindenter was modified to make finely controlled, low-load scratches. Scratches at various loads and two orientations of a Berkovich scratching diamond were made in films of 100 nm of gold and 200 nm of copper, each on single crystal silicon. For each film type, samples with no interlayer, with an SiO2 interlayer, and with a TiW on SiO2 interlayer were tested. The scratch morphology was found to vary in a regular way with load, diamond orientation and interlayer material.

This is a preview of subscription content, access via your institution.

References

  1. 1.

    J. Valli and U. Makela, Wear 115, 215 (1987).

    Article  Google Scholar 

  2. 2.

    P.J. Burnett and D.S. Rickerby, Thin Solid Films 157, 233 (1990).

    Article  Google Scholar 

  3. 3.

    P.A. Steinmann, Y. Tardy, and H.E. Hintermann, Thin Solid Films 154, 333 (1987).

    CAS  Article  Google Scholar 

  4. 4.

    J. Sekler, P.A. Steinmann, and H.E. Hintermann, Surf. Coatings Technol. 36, 519 (1988).

    CAS  Article  Google Scholar 

  5. 5.

    T.W. Wu, J. Mater. Res. 6, 407 (1991).

    Article  Google Scholar 

  6. 6.

    J. B. Pethica, R. Hutchings, and W.C. Oliver, Philos. Mag. A48, 593 (1983).

    Article  Google Scholar 

  7. 7.

    W.C. Oliver, Mater. Res. Soc Bulletin 11, 15 (1986).

    Article  Google Scholar 

  8. 8.

    W.C. Oliver, C.J. McHargue, and S.J. Zinkle, Thin Solid Films 153, 185 (1987).

    CAS  Article  Google Scholar 

Download references

Author information

Affiliations

Authors

Corresponding author

Correspondence to S. D. McAdams.

Rights and permissions

Reprints and Permissions

About this article

Cite this article

McAdams, S.D., Tsui, T.Y., Oliver, W.C. et al. Effects of Interlayers on the Scratch Adhesion Performance of Ultra-Thin Films of Copper and Gold on Silicon Substrates. MRS Online Proceedings Library 356, 809–814 (1994). https://doi.org/10.1557/PROC-356-809

Download citation