Elastic, Transversely Isotropic Film Indented by a Punch; Application to Multilayered Thin Films

MRS Online Proceedings Library volume 356, pages687–691(1994)Cite this article

Abstract

A model calculates the compliance of elastic contact between a punch and bilayer, the latter consisting of a transversely isotropic film on top of isotropic substrate. Used in data analysis, the model helps estimate the Young’s modulus of amorphous silicon (100±20 GPa) layers within amorphous silicon/aluminum multilayer composites deposited on silicon.

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  1. Department of Materials Science and Engineering, University of Wisconsin, 1509 University Ave, Madison, WI, 53706, USA

    D. S. Stone

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  1. D. S. Stone
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Stone, D.S. Elastic, Transversely Isotropic Film Indented by a Punch; Application to Multilayered Thin Films. MRS Online Proceedings Library 356, 687–691 (1994). https://doi.org/10.1557/PROC-356-687

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