Effect of High Temperature Deformation on Grain Boundary Defects in Yba2Cu3O7-X

Abstract

The results of transmission electron microscopy studies on YBa2Cu3O7-x subjected to high temperature extrusion are presented. Particular emphasis is put on high temperature accommodation processes of lattice dislocations into sub-grain boundaries. It is suggested from the electron microscopy observations that stress induced climb mechanisms for dislocations are operative. Also presented is evidence of localized lattice distortions near twin boundaries due to isothermal high temperature deformation. Preliminary results on the structure of grain boundary facets and steps is described. The implications of these results for texture development in bulk ceramic superconductors is also discussed.

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Correspondence to R. Garcia.

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Garcia, R., Misiolek, W.Z., Wright, R.N. et al. Effect of High Temperature Deformation on Grain Boundary Defects in Yba2Cu3O7-X . MRS Online Proceedings Library 169, 827–830 (1989). https://doi.org/10.1557/PROC-169-827

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