Wafer Bonding for Backside Illuminated CMOS Image Sensors Fabrication


Backside illuminated CMOS image sensors were developed in order to encompass the pixel area limitation due to metal interconnects. In this technology the fully processed CMOS wafer is bonded to a blank carrier wafer and then back-thinned in order to open the photosensitive sensor area. The process flows of the two main competing wafer bonding technologies used for this manufacturing process (adhesive bonding and low temperature plasma activated direct wafer bonding with polymer layers) will be reviewed.

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  1. 1.

    V. Dragoi in Integrated Optics: Devices, Materials, and Technologies X, edited by Y. Sidorin and C. A. Wächter, (SPIE Proc. 6123, Bellingham, WA, 2006) pp. 612314-1-15.

  2. 2.

    V. Dragoi, G. Mittendorfer, C. Thanner and P Lindner, J. Microsyst. Techn. 14, 509 (2008).

    CAS  Article  Google Scholar 

  3. 3.

    V. Dragoi, T. Glinsner, G. Mittendorfer, B. Wieder and P. Lindner in Smart Sensors, Actuators, and MEMS, edited by J.-C. Chiao, V. K. Varadan and C. Cane, (SPIE Proc. 5116, Bellingham, WA, 2003) pp. 160–167.

  4. 4.

    M. Alexe, V. Dragoi, M. Reiche and U. Gösele, Electron. Lett. 36 (7), pp. 677–678 (2000).

  5. 5.

    T. Matthias, G. Mittendorfer, C. Thanner, P. Lindner, T. Glinsner and V. Dragoi, ECS Trans. 3 (6), pp. 369–375 (2006).

  6. 6.

    E. Cakmak, V. Dragoi, E. Capsuto, C. McEwen and E. Pabo, J. Microsyst. Techn. 16 (5), pp. 799–808 (2010).

  7. 7.

    P. T. Baine, M. Bain, D. W. McNeill, H. S. Gamble and B. M. Armstrong, ECS Trans. 3 (6), pp. 165–173 (2006).

  8. 8.

    V. Dragoi, G. Mittendorfer, C. Thanner and P. Lindner, J. Microsyst. Techn. 14 (4–5), pp. 509–515 (2008).

  9. 9.

    V. Dragoi, M. Alexe, M. Hamacher and H. Heidrich, ECS Trans. 16 (8), pp. 105–115 (2008).

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Correspondence to Viorel Dragoi.

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Dragoi, V., Mittendorfer, G., Filbert, A. et al. Wafer Bonding for Backside Illuminated CMOS Image Sensors Fabrication. MRS Online Proceedings Library 1249, 806 (2010). https://doi.org/10.1557/PROC-1249-F08-06

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