Investigation of Joule heating effect in various stages of electromigration in flip-chip solder joints by infrared microscopy

Abstract

The Joule heating effect at various stages under electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 A at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints increased with the bump resistance and the increase of current stressing time. It increased very slowly in initial stages. In the last stage, the temperature of the solder bump increased rapidly due to the increase of the bump resistance and the local Joule heating effect.

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References

  1. 1.

    Semiconductor Industry Association, International Roadmap for Semiconductor Technology, San Jose, CA, 2006.

  2. 2.

    K. N. Tu, “Recent advances on electromigration in very-large-scale-integration of interconnects,” J. Appl. Phys., Vol. 94, No. 9, pp. 5451–5473, 2003.

  3. 3.

    E. C. C. Yeh, W. J. Choi, K. N. Tu, P. Elenius and H. Balkan, “Current-crowding-induced electromigration failure in flip chip solder joints,” Appl. Phys. Lett., Vol. 80, No. 4, pp. 580–582, 2002.

  4. 4.

    J. W. Nah, K. W. Paik, J. O. Suh and K. N. Tu, “Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints,” J. Appl. Phys., Vol. 94, No. 12, pp. 7560–7566, 2003.

  5. 5.

    L. Zhang, S. Ou, J. Huang, K. N. Tu, S. Gee and L. Nguyen, “Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints,” Appl. Phys. Lett., Vol. 88, 012106, 2006.

  6. 6.

    Y. W. Chang, S. W. Liang and C. Chen, “Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes,” Appl. Phys. Lett., Vol. 89, 032103, 2006.

  7. 7.

    T. L. Shao, S. H. Chiu, Chih Chen, D. J. Yao, and C. Y. Hsu, J. Electron. Mater. 33, 1350 (2004).

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Correspondence to Chih Chen.

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Hsiao, H.Y., Chen, C. & Yao, D.J. Investigation of Joule heating effect in various stages of electromigration in flip-chip solder joints by infrared microscopy. MRS Online Proceedings Library 1249, 801 (2010). https://doi.org/10.1557/PROC-1249-F08-01

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