Abstract
This paper outlines the issues related to RF MEMS packaging and low actuation voltage. It is presented an original approach concerning the modeling of the capacitive contact using multi-physics simulation and advanced characterization. A similar approach is used concerning the packaging development where multi-physic simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.
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Peyrou, D., PENNEC, F., Achkar, H. et al. BCB Based Packaging for Low Actuation Voltage RF MEMS Devices. MRS Online Proceedings Library 969, 506 (2006). https://doi.org/10.1557/PROC-0969-W05-06
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DOI: https://doi.org/10.1557/PROC-0969-W05-06