This paper outlines the issues related to RF MEMS packaging and low actuation voltage. It is presented an original approach concerning the modeling of the capacitive contact using multi-physics simulation and advanced characterization. A similar approach is used concerning the packaging development where multi-physic simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.
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G.M.Rebeiz, J.B.Muldavin, “RF MEMS switches and switch circuits”, IEEE Microwave magazine, pp. 59–71, Dec. 2001.
S.Mellé, D.De Conto, D.Dubuc, K.Grenier, O.Vendier, J.L.Muraro, J.L.Cazaux, R.Plana, “Reliability Modeling of capacitive RF-MEMS”, IEEE Transactions on Microwave Theory and Techniques, Vol.53, No 11, pp.3482–3488. Nov. 2005.
X.Yuan, Z.Peng, J.C.M.Wang, D.Forehand, C.Goldsmith “Acceleration of dielectric charging in RF MEMS capacitive switches”, IEEE Transactions on device and materials reliability, vol.6, no4, December 2006, pp 556–563.
J.R.Reid and R.T.Webster “Measurements of charging in capacitive microelectromechanical switches” Electron lett, vol 38, n024, pp 1544–1545, Nov 2002.
W.M. van Sprengen, R.Puers, R.Mertens and I.De Wolf “A comprehensive model to predict the charging and reliability of RF MEMS switches” J.Micromech. Microeng., vol 14, n04, pp 514–521, Jan 2004.
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Peyrou, D., PENNEC, F., Achkar, H. et al. BCB Based Packaging for Low Actuation Voltage RF MEMS Devices. MRS Online Proceedings Library 969, 506 (2006). https://doi.org/10.1557/PROC-0969-W05-06