BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

MRS Online Proceedings Library volume 969, Article number: 506 (2006) Cite this article

Abstract

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. It is presented an original approach concerning the modeling of the capacitive contact using multi-physics simulation and advanced characterization. A similar approach is used concerning the packaging development where multi-physic simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.

This is a preview of subscription content, access via your institution.

Access options

Buy single article

Instant access to the full article PDF.

US$ 39.95

Tax calculation will be finalised during checkout.

References

  1. 1.

    G.M.Rebeiz, J.B.Muldavin, “RF MEMS switches and switch circuits”, IEEE Microwave magazine, pp. 59–71, Dec. 2001.

  2. 2.

    S.Mellé, D.De Conto, D.Dubuc, K.Grenier, O.Vendier, J.L.Muraro, J.L.Cazaux, R.Plana, “Reliability Modeling of capacitive RF-MEMS”, IEEE Transactions on Microwave Theory and Techniques, Vol.53, No 11, pp.3482–3488. Nov. 2005.

    Article  Google Scholar 

  3. 3.

    X.Yuan, Z.Peng, J.C.M.Wang, D.Forehand, C.Goldsmith “Acceleration of dielectric charging in RF MEMS capacitive switches”, IEEE Transactions on device and materials reliability, vol.6, no4, December 2006, pp 556–563.

    Article  Google Scholar 

  4. 4.

    J.R.Reid and R.T.Webster “Measurements of charging in capacitive microelectromechanical switches” Electron lett, vol 38, n024, pp 1544–1545, Nov 2002.

  5. 5.

    W.M. van Sprengen, R.Puers, R.Mertens and I.De Wolf “A comprehensive model to predict the charging and reliability of RF MEMS switches” J.Micromech. Microeng., vol 14, n04, pp 514–521, Jan 2004.

    Article  Google Scholar 

Download references

Author information

Affiliations

  1. LAAS-CNRS, Toulouse, 31077, France

    David Peyrou, Fabienne PENNEC, Hikmat Achkar, Patrick PONS, Fabio Coccetti, Hervé Aubert & Robert Plana

Authors
  1. David Peyrou
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Fabienne PENNEC
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Hikmat Achkar
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Patrick PONS
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Fabio Coccetti
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Hervé Aubert
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Robert Plana
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to David Peyrou.

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Peyrou, D., PENNEC, F., Achkar, H. et al. BCB Based Packaging for Low Actuation Voltage RF MEMS Devices. MRS Online Proceedings Library 969, 506 (2006). https://doi.org/10.1557/PROC-0969-W05-06

Download citation