A flash lamp has been proposed for annealing wafers with diameters approaching 100 mm. The equipment applies a pulse, with duration 0.5 ms to 20 ms, resulting in large transient thermal gradients in the wafer. In this paper, we present a model for the thermal reaction of this process and its effect upon the mechanical behaviour, in order to predict stresses, shape changes and to capture practical phenomenon, such as bifurcation of deformation modes. We then use the model to follow changes in the expected response consequent on altering process conditions, as well as exploring important issues associated with scaling to large wafer sizes. The model is further used to predict material yielding leading to permanent deformations. This work presents the first description of the thermo-mechanical response of wafers to flash lamp annealing in the millisecond time regime and is therefore fundamental to the use of this technique in the fabrication of semiconductor devices.
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International Technology Roadmap for Semiconductors, http://public.itrs.net
T. Gebel, M. Voelskow, W. Skorupa, G. Mannino, V. Privitera, F. Priolo, E. Napolitani and A. Carnera, Nuclear Instruments and Methods in Physics Research B186 (2002) p287–291.
L. B. Freund, Journal of the Mechanics and Physics of Solids, Vol. 48 (2000) p1159–1174.
W. Skorupa, et al., Proc. XIII. Int. Conf. Advanced Thermal Processing of Semiconductors (RTP 2005) (2005) p53–71.
M. Smith, R. McMahon, M. Voelskow, W. Skorupa, Journal of Applied Physics 96 (2004) p4843.
J. P. Holman, Heat Transfer 8th ed. (McGraw-Hill, USA, 1997).
O. Heavens, Optical Properties of Thin Solid Films, (Butterworth, London, 1955).
B. Sun, X. Zhang, C. Grigoropoulos, International Journal of Heat and Mass Transfer, 40 (1997), p1591–1600.
EMIS Datareview, Properties of Silicon, Series No. 4. (INSPEC, London, 1988).
Abaqus Inc., www.hks.com.
K. A. Seffen, Department of Engineering, University of Cambridge Technical Report CUED/D-Struct/TR 217.
H. Alexander and P. Haasen, Solid State Physics, Vol. 22 (1968) p27–158.
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Smith, M.P., Seffen, K.A., McMahon, R.A. et al. Thermally Induced Deformation and Stresses During Millisecond Flash Lamp Annealing. MRS Online Proceedings Library 912, 408 (2005). https://doi.org/10.1557/PROC-0912-C04-08