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Enhanced tensile ductility in an electrodeposited nanocrystalline copper

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Abstract

A fully dense nanocrystalline (nc) Cu with mean grain size of 72 nm and a broad grain size distribution was synthesized by electrodeposition. Uniaxial tensile tests were done at different strain rates and room temperature. A very high strength of 1.04 G was obtained at strain rate of 0.1 s−1. The nearly perfect plasticity with a large strain of close to 20% was displayed at specific low strain rates of 4 × 10−5 to 10−4 s−1. With increasing strain rate, the nearly perfect plasticity disappeared. Strain rate sensitivity and activation volume of the nc Cu were estimated from the flow stress at a fixed strain of 1% and a strain rate change (jump) test. It was deduced from the high strain rate sensitivity exponent of 0.08 and small activation volume of 12b3 that both dislocation and grain boundary activities would take place in this nc Cu, which explained the nearly perfect plasticity observed in the tensile test.

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Acknowledgments

This work was supported by the Foundation of National Key Basic Research and Development Program (No. 2004CB619301), the National Natural Science Foundation of China (No. 50771049), and Project 985-automotive engineering of Jilin University.

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Authors and Affiliations

  1. Key Laboratory of Automobile Materials, College of Materials Science and Engineering, Jilin University, Changchun, 130025, People’s Republic of China

    Guoyong Wang, Zhonghao Jiang, Hanzhuo Zhang & Jianshe Lian

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  1. Guoyong Wang
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  2. Zhonghao Jiang
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  4. Jianshe Lian
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Correspondence to Jianshe Lian.

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Wang, G., Jiang, Z., Zhang, H. et al. Enhanced tensile ductility in an electrodeposited nanocrystalline copper. Journal of Materials Research 23, 2238–2244 (2008). https://doi.org/10.1557/JMR.2008.0280

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  • DOI: https://doi.org/10.1557/JMR.2008.0280

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