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Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

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Abstract

This study investigates interfacial reactions of (Sn–9Zn) + xCu/Ni systems. Ni5Zn21, Cu5Zn8, (Ni,Zn,Cu)3Sn4, (Cu,Ni,Zn)6Sn5, and Cu6Sn5 phases were formed on the Sn–9Zn/Ni interface at 240–270 °C, when 0–10 wt% Cu was added to the Sn–9Zn solder. Experimental results indicate that changing the concentration of Cu in the Sn–9Zn solder dramatically changes the formation of intermetallic compounds (IMCs) in the (Sn–9Zn) + xCu/Ni system. Different diffusion and segregation rates of elements are the main reasons for a change in the IMC evolution.

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Authors and Affiliations

  1. Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei, 10672, Taiwan, Republic of China

    Yee-wen Yen & Wei-kai Liou

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  1. Yee-wen Yen
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  2. Wei-kai Liou
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Correspondence to Yee-wen Yen.

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Yen, Yw., Liou, Wk. Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate. Journal of Materials Research 22, 2663–2667 (2007). https://doi.org/10.1557/JMR.2007.0339

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  • DOI: https://doi.org/10.1557/JMR.2007.0339

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