Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

Abstract

The microstructure and adhesion strength of the Sn-0.7Cu/Cu solder joints were examined. The acicular η(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn-3.5Ag alloy, the Sn-0.7Cu solder showed comparable wettability, but lower microhardness and joint strength. After aging, the acicular η-phase grew into a round and scallop-shaped morphology, thin є(Cu3Sn)-phase evolved just above the Cu substrate, and the joint strength decreased linearly with aging time.

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Correspondence to Kyoo-Sik Bae.

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Bae, KS., Kim, SJ. Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints. Journal of Materials Research 17, 743–746 (2002). https://doi.org/10.1557/JMR.2002.0108

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