Camber development during cofiring Ag-based low-dielectric-constant ceramic package

Abstract

Camber (curvature) development during cofiring a two-layered structure of Ag film/low-dielectric-constant, low-temperature cofired ceramic (LTCC) green tape has been investigated. At a given thickness of Ag film, both the camber and camber rate decrease linearly with increasing the square thickness of LTCC. Densification mismatch between Ag and LTCC is attributed to be the root cause for the camber generation during cofiring. Mathematical analysis is made to theoretically describe the camber development, and the results show a fairly good agreement with experimental observations.

This is a preview of subscription content, access via your institution.

References

  1. 1.

    R. R. Tummala, J. Am. Ceram. Soc. 74, 895 (1991).

    CAS  Article  Google Scholar 

  2. 2.

    T. K. Gupta and J-H. Jean, J. Mater. Res. 11, 243 (1996).

  3. 3.

    Y. Shimada, K. Utsumi, and T. Ikeda, Int. J. Hybrid Microelectron. 7, 29 (1984).

  4. 4.

    J. I. Steinberg, S. J. Horowitz, and R. J. Bacher, in Advances in Ceramics, edited by J. B. Blum and W. R. Cannon (Am. Ceram. Soc., Westerville, OH, 1986), Vol. 19, p. 31.

  5. 5.

    J-H. Jean and T. K. Gupta, IEEE CHMT Part B: Adv. Packaging 17, 228 (1994).

  6. 6.

    Y. Shimada, Y. Yamashita, and H. Takamizawa, IEEE CHMT 11, 163 (1988).

  7. 7.

    D. M. Mattox, S. R. Gurkovich, J. A. Olenick, and K. M. Mason, Ceram. Eng. Sci. Proc. 9 (11–12), 1567 (1988).

  8. 8.

    J. U. Knickerbocker, Am. Ceram. Soc. Bull. 71, 1393 (1992).

  9. 9.

    A. H. Kumar and R. R. Tummala, Int. J. Hybrid Microelectron. 14, 137 (1991).

  10. 10.

    R. K. Bordia and R. Raj, J. Am. Ceram. Soc. 68, 287 (1985).

  11. 11.

    C. H. Hsueh and A. G. Evans, J. Am. Ceram. Soc. 68, 120 (1985).

  12. 12.

    T. Cheng and R. Raj, J. Am. Ceram. Soc. 72, 1649 (1989).

  13. 13.

    G-Q. Lu, R. C. Sutterlin, and T. K. Gupta, J. Am. Ceram. Soc. 76, 1907 (1993).

  14. 14.

    G-Q. Lu, Alcoa Report No. 04-90-05 (1990).

  15. 15.

    Technical publication of FERROTAPE-A6, Ferro Corp., 1996.

  16. 16.

    T. R. Tauchert, in Thermal Stress I, edited by R. B. Hetnarski (Elsevier Science, New York, 1986), Chap. 2.

  17. 17.

    J-H. Jean and C-R. Chang, unpublished.

  18. 18.

    M. Ohring, in The Materials Science of Thin Films (Academic Press, San Diego, CA, 1991), Chap. 9.

  19. 19.

    R. K. Bordia and G. W. Scherer, Acta Metall. 36, 2393 (1988).

  20. 20.

    G. F. Carter, in Metals Handbook, edited by H. E. Boyer and T. L. Gall (ASM, Metals Park, OH, 1985), p. 2.

  21. 21.

    D. E. Campbell and H. E. Hagy, in CRC Handbook of Materials Science, edited by C. T. Lynch (CRC Press, Boca Raton, FL, 1975), Sec. 2.

  22. 22.

    R. K. Bordia and G. W. Scherer, Acta Metall. 36, 2399 (1988).

  23. 23.

    F. T. Trouton, Proc. R. Soc. London 77, 426 (1906).

  24. 24.

    C. Herring, J. Appl. Phys. 21, 437 (1950).

  25. 25.

    R. L. Coble, J. Appl. Phys. 34, 1679 (1963).

  26. 26.

    T. Oda, T. Takada, and S. Kachi, J. Jpn. Soc. Powder Met. 14, 118 (1967).

  27. 27.

    A. Sobaszek, Nukleonika 13, 279 (1969).

    Google Scholar 

  28. 28.

    J. K. Mackenzie and R. Shuttleworth, Proc. Phys. Soc. London 62, 833 (1949).

  29. 29.

    J. K. Mackenzie, Proc. Phys. Soc. London, Sec. B 63, 2 (1950).

  30. 30.

    W. D. Kingery, H. K. Bowen, and D. R. Uhlmann, in Introduction to Ceramics, 2nd ed. (John Wiley & Sons, New York, 1976), p. 758.

  31. 31.

    J-H. Jean and C-R. Chang, unpublished.

Download references

Author information

Affiliations

Authors

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Jean, J.H., Chang, C.R. Camber development during cofiring Ag-based low-dielectric-constant ceramic package. Journal of Materials Research 12, 2743–2750 (1997). https://doi.org/10.1557/JMR.1997.0365

Download citation