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Thermal transfer printing technique for electrode patterning in cofired ceramic multi-layer devices

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Abstract

A new mask-less electrode patterning method using a thermal transfer printing technique was investigated. Thermal ink ribbons were prepared, which included more than 50 vol. % conductive metal powder. Arbitrary electrode patterns were designed with a computer and printed out on a ceramic green sheet with a serial thermal printer. The ceramic green sheets with printed electrode patterns were stacked up and cofired to obtain a multi-layer ceramic capacitor.

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Authors and Affiliations

  1. Materials and Devices Laboratories, Research and Development Center, Toshiba Corporation, Kawasaki, 210, Japan

    Kumi Okuwada & Tetsuo Okuyama

Authors
  1. Kumi Okuwada
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  2. Tetsuo Okuyama
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Okuwada, K., Okuyama, T. Thermal transfer printing technique for electrode patterning in cofired ceramic multi-layer devices. Journal of Materials Research 9, 1193–1198 (1994). https://doi.org/10.1557/JMR.1994.1193

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  • DOI: https://doi.org/10.1557/JMR.1994.1193

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