Additive enhanced nonaqueous electrodeposition of silver on Ba2YCu3O7

Abstract

A nonaqueous plating bath for silver deposition on the Ba2YCu3O7 superconductor has been modified with thiourea to give enhanced coverage of the metal film at low thicknesses. For both porous and high density ceramic substrates, SEM and optical microscopy show nucleation of silver deposits is increased by the additive. The resulting silver-superconductor contact resistances are comparable to those achieved without additives. Adhesion of the deposits and ease of mechanical handling are improved with thiourea. The combination of highly reactive oxidized substrate, nonaqueous solvent, and strongly surface active agent forms a novel extension for electrodeposition science.

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Correspondence to J. M. Rosamilia.

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Rosamilia, J.M., Miller, B. Additive enhanced nonaqueous electrodeposition of silver on Ba2YCu3O7. Journal of Materials Research 5, 1612–1615 (1990). https://doi.org/10.1557/JMR.1990.1612

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