Electrical performance and reaction kinetics of silicone gels

Abstract

Silicone gels are becoming more accepted as protective coatings for Very Large Scale Integrated circuits (VLSI) against severe environments due to their excellent electrical, thermal, and mechanical properties. Recent studies indicate that high performance silicone gels in low-cost, non-hermetic plastic packaging may replace conventional hermetic ceramic packaging. This paper describes the use of the soft silicone gels as coatings on Integrated Circuit (IC) devices, and the correlation between the material’s cure temperature and cure time versus their adhesion and electrical reliability during 85°C, 85% RH and bias accelerating testing. In addition, the reaction kinetics of the silicone gel based on the Differential Scanning Calorimetry (DSC) study of the uncured sample will be reported.

This is a preview of subscription content, access via your institution.

References

  1. 1

    VLSI Technology, edited by S. M. Sze (McGraw-Hill, New York, 1983).

    Google Scholar 

  2. 2

    C. P. Wong, Advances in Polymer Science (Springer-Verlag, 1988), Vol. 84, pp. 63–83.

  3. 3

    C. P. Wong, in The Encyclopedia of Polymer Science and Engineering (John Wiley and Sons, New York, 1986), 2nd ed., Vol. 5, p. 638.

    Google Scholar 

  4. 4

    C. P. Wong, in Polymers for Electronic Applications (CRC Press, Boca Raton, FL, 1989), pp. 63–92.

    Google Scholar 

  5. 5

    K. Otsuka, Y. Shirai, and K. Okutani, IEEE Transactions on Components, Hybrids, and Manufacturing Technology CHMT-7 (3), 249 (1984).

  6. 6

    C. P. Wong, Electronic Packaging Materials Science III (Proc. Mater. Res. Soc. Symp.) (Materials Research Society, Pittsburgh, PA, 1988), Vol. 108, p. 175.

  7. 7

    W. Noll, Chemistry and Technology of Silicones (Academic Press, New York, 1968).

    Google Scholar 

  8. 8

    C. P. Wong, Polymer Science and Engineering Proceedings (American Chemical Society, 1986), Vol. 55, p. 803.

  9. 9

    H. J. Borchardt and F. J. Daniels, J. Am. Chem. Soc. 79, 41 (1956).

    Article  Google Scholar 

  10. 10

    C. P. Wong, J. M. Segelken, and J. W. Balde, IEEE Trans. on Components, Hybrids, and Manufacturing Technology 12 (4), 419 (1989).

    Article  Google Scholar 

  11. 11

    C. P. Wong, U. S. Patent 4810768 (March 7, 1989).

Download references

Author information

Affiliations

Authors

Corresponding author

Correspondence to C. P. Wong.

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Wong, C.P. Electrical performance and reaction kinetics of silicone gels. Journal of Materials Research 5, 79 (1990). https://doi.org/10.1557/JMR.1990.0795

Download citation