Abstract
Starting with corrosion-resistant amorphous Fe32Ni36Cr14P12B6 alloy material, rf sputter deposition has been successfully used to deposit amorphous thin films very similar in composition onto low-carbon (i.e., 1008) steel. The effects that varying sputter deposition parameters has on a film’s corrosion resistance, microstructure, and chemical composition have been examined. Optical, scanning, and transmission electron microscopy, Auger depth profiling, and x-ray diffraction were used to characterize the microstructure and composition of the films, while the corrosion resistance was determined by anodic polarization in basic and acidic solutions. A ∼4000 Å thick amorphous film sputtered at ambient temperature onto a 0.05 μm polished 1008 steel substrate improved the corrosion resistance of the steel in a buffered borate solution by lowering the steel’s critical current density by two orders of magnitude and by raising its corrosion potential by ∼0.4 V. Bias voltage sputtering was required to produce a film with properties that could withstand a sulfuric acid solution. For example, a film sputtered at – 70 V at ambient temperature onto a steel substrate passivated in sulfuric acid solution, whereas the steel was completely active in this solution without the sputtered film. Passive current densities in this case were ∼2x102μA/cm2. In both solutions the improved corrosion resistance was exhibited by films with lower oxygen content and a denser microstructure. Thus a direct correlation between corrosion resistance, microstructure, and composition is shown.
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References
- 1
J. A. Thornton J. Vac. Sci. Technol. 11, 666 (1974).
- 2
W. D. Westwood, Prog. Surf. Sci. 7, 71 (1976).
- 3
S. Craig and G. L. Harding, J. Vac. Sci. Technol. 19, 205 (1981).
- 4
J. H. Brophy, R. M. Rose, and J. Wulff, The Structure and Properties of Materials (Wiley, New York, 1964), Vol. 2.
- 5
B. A. O’Korie and W. B. Nowak, J. Electrochem. Soc. 130, 290 (1983).
- 6
T. Kulik, J. Baszkiewicz, M. Kaminski, J. Latuszkiewicz, and H. Matyja, Corros. Sci. 19, 1001 (1979).
- 7
T. M. Devine, J. Electrochem. Soc. 124, 38 (1977).
- 8
R. L. Chance and R. G. Ceselli, General Motors Research Laboratories Publication GMR-4139 (July 1982).
- 9
W. B. Nowak and B. A. Okorie, Corrosion 38(6), 314 (1982).
- 10
B. A. Okorie and W. B. Nowak, J. Electrochem. Soc. 130(2), 290 (1983).
- 11
R. B. Diegle and M. D. Merz, J. Electrochem. Soc. 130(9), 2030 (1980).
- 12
R. B. Diegle, D. M. Lineman, and W. K. Boyd, Interim Technical Report, Office of Naval Research Contract No. 0014-77-C-0488, Battelle Columbus Laboratories, Columbus, Ohio, 1 May 1977–30 April 1978.
- 13
M. P. Rosenblum and D. Turnbull, J. Non-Cryst. Solids 37 (1980).
- 14
K. L. Chopra, Thin Film Phenomena (McGraw-Hill, New York, 1969).
- 15
J. J. Kim, Diss. Abstr. Int. B 47, 180 (1987).
- 16
R. M. Williams, A. P. Thakoor, S. K. Khana, and W. L. Johnson, J. Electrochem. Soc. 131, 2791 (1984).
- 17
A. P. Thakoor, S. K. Khanna, R. M. Williams, and R. F. Landel, J. Vac. Sci. Technol. A 1, 520 (1983).
- 18
A. J. Aranson, D. Chen, and W. H. Class, Thin Solid Films 72(3), 535 (1980).
- 19
P. M. Fabis, Thin Solid Films 128 (1–2), 57 (1985).
- 20
A. Aubert, J. Danroc, A. Gaucher, and J. P. Terrat, Thin Solid Films 126 (1–2), 61 (1985).
- 21
A. P. Thakoor, J. L. Lamb, R. M. Williams, and S. K. Khanna, J. Vac. Sci. Technol. A 3(3), 600 (1985).
- 22
B. O. Johansson, J. E. Sundgren, J. E. Green, A. Rockett, and A. Barnett, J. Vac. Sci. Technol. A 3(2), 303 (1985).
- 23
R. G. Walmsley, Y. S. Lee, A. F. Marshall, and D. A. Stevenson, J. Non-Cryst. Solids 60–62, 625 (1984).
- 24
J. A. Thornton, Surf. Eng. 2(4), 283 (1986).
- 25
K. Ogura and T. Majima, Electrochim. Acta. 23, 1361 (1978).
- 26
R. Schulz, N. L. Lee, and B. M. Clemens, J. Mater. Res. 2, 46 (1987).
- 27
J. L. Vossen, J. Vac. Sci. Technol. 8, 512 (1971).
- 28
J. L. Vossen and J. J. O’Neill, Jr., RCA Rev. 29, 566 (1968).
- 29
R. Messier and R. C. Ross, J. Appl. Phys. 53, 6220 (1982).
- 30
A. Barna, P. B. Barna, Z. Bodo, J. F. Pocza, I. Pozsgai, and G. Radnoczi, in Amorphous and Liquid Semiconductors (Taylor and Francis, London, 1974), p. 109.
- 31
A. G. Dirks and H. J. Leamy, Thin Solid Films 47, 219 (1977).
- 32
F. L. Galeener, Phys. Rev. Lett. 27, 1716 (1971).
- 33
W. Fuhs, H. J. Heese, and K. H. Langer, in Amorphous and Liquid Semiconductors (Taylor and Francis, London, 1974), p. 79.
- 34
A. Staudinger and S. Nakahara, Thin Solid Films 45, 125 (1977).
- 35
J. J. Hauser and A. Staudinger, Phys. Rev. B 8, 607 (1973).
- 36
R. A. Roy and R. Messier, J. Vac. Sci. Technol. 2, 312 (1984).
- 37
J. C. Knights and R. A. Lujan, Appl. Phys. Lett. 35, 244 (1979).
- 38
J. A. Thornton, J. Vac. Sci. Technol. 11, 66 (1974).
- 39
J. A. Thornton, Thin Solid Films 40, 335 (1977).
- 40
M. Marinov, Thin Solid Films 46, 267 (1977).
- 41
E. Eser, R. E. Ogilvie, and K. A. Taylor, Thin Solid Films 67, 265 (1980).
- 42
J. E. Sundgren, B. O. Johansson, H. T. G. Hentzell, and S. E. Karlsson, Thin Solid Films 105, 385 (1983).
- 43
R. D. Bland, G. J. Kominiak, and D. M. Mattox, J. Vac. Sci. Technol. 11, 671 (1974).
- 44
D. M. Mattox and G. J. Kominiak, J. Vac. Sci. Technol. 9, 528 (1972).
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Lee, N.L., Fisher, G.B. & Schulz, R. Sputter deposition of a corrosion-resistant amorphous metallic coating. Journal of Materials Research 3, 862–871 (1988). https://doi.org/10.1557/JMR.1988.0862
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