ADHESION ADHESIVES&SEALANTS

, Volume 11, Issue 1, pp 26–29 | Cite as

Rapid bonding of non-metallic materials

Bonding and sealing via induction curing
Plant and Processing Equipment

Notes

Thanks

We would like to thank IFF GmbH and Evonik Industries AG for their support with the measurements and for the invaluable technical discussions.

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Copyright information

© Springer Fachmedien Wiesbaden 2014

Authors and Affiliations

  1. 1.Polytec PT GmbHWaldbronnGermany
  2. 2.IFF GmbHIsmaningGermany

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