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ADHESION ADHESIVES&SEALANTS

, Volume 10, Issue 4, pp 22–27 | Cite as

Ultra high-resolution imaging of interface layers

Combination of ion beam milled cross sections and modern field emission scanning electron microscopy
  • Jens Holtmannspötter
  • Michael Wetzel
  • Jürgen von Czarnecki
  • Rolf Brucksch
Research and Development
  • 12 Downloads

Modern field-emission scanning electron microscopes allow a detailed and realistic imaging of surfaces at micro- and nanometre scale. In combination with new sample preparation techniques, interfaces can be shown at high resolution with little effort.

By using adhesives, adherents are joined via their surfaces. For the phenomena adhesion, the condition of the surfaces (topography, chemistry) plays a dominant role. Scanning electron microscopy is an established surface analysis method to image surface structures from milli- down to nanometre scale [1].

In the past years, new field-emission scanning electron microscopes (FE-SEMs) with major benefits for research activities concerning adhesive bonding were developed. Additionally, new sample preparation techniques allow a simple preparation for high resolution imaging of interfaces. In combination, interfaces can now be shown at high resolution with low effort.

In this paper, the benefits of new scanning electron microscopes for surface...

References

  1. [1]
    Goldstein, J.: “Scanning Electron Microscopy and X-Ray Microanalysis”, 3rd issue, Kluwer Academic, 2003CrossRefGoogle Scholar
  2. [2]
    Rousel, L. Y. et al.: “Extreme high resolution scanning electron microscopy (XHR SEM) and beyond”, Scanning Microscopy 2009Google Scholar
  3. [3]
    Erdmann, N. et al.: “Precise SEM Cross Section Polishing via Argon Beam Milling”, Microscopy Today, Mai 2006Google Scholar

Copyright information

© Springer Fachmedien Wiesbaden 2013

Authors and Affiliations

  • Jens Holtmannspötter
    • 1
  • Michael Wetzel
    • 1
  • Jürgen von Czarnecki
    • 1
  • Rolf Brucksch
    • 1
  1. 1.MunichGermany

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