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ADHESION ADHESIVES&SEALANTS

, Volume 10, Issue 2, pp 14–17 | Cite as

Reliable, flexible and efficient

  • Tobias Königer
Applications Encapsulants for microelectronics
  • 9 Downloads

Copyright information

© Springer Fachmedien Wiesbaden 2013

Authors and Affiliations

  1. 1.Delo Industrie KlebstoffeWindachGermany

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