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Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

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Abstract

Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investigated. Electron probe microanalyzer (EPMA) analyses reveal that the element oxygen distributes uniformly within the solder matrix after soldering, while Ti segregates effectively at the ITO/solder and Cu/solder interfaces at such a low temperature, giving satisfactory joining results of Cu/Cu, ITO/ITO, and ITO/Cu in air.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan

    S. Y. Chang, L. C. Tsao, M. J. Chiang & T. H. Chuang

  2. Metal Industries R&D Centre, 811, Kaohsiung, Taiwan

    C. N. Tung & G. H. Pan

Authors
  1. S. Y. Chang
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  2. L. C. Tsao
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  3. M. J. Chiang
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  4. T. H. Chuang
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  5. C. N. Tung
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  6. G. H. Pan
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Chang, S.Y., Tsao, L.C., Chiang, M.J. et al. Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler. J. of Materi Eng and Perform 12, 383–389 (2003). https://doi.org/10.1361/105994903770342890

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  • DOI: https://doi.org/10.1361/105994903770342890

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