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Transfer bonding technology for batch fabrication of SMA microactuators

  • T. Grund
  • R. Guerre
  • M. Despont
  • M. Kohl
Article

Abstract.

Currently, the broad market introduction of shape memory alloy (SMA) microactuators and sensors is hampered by technological barriers, since batch fabrication methods common to electronics industry are not available. The present study intends to overcome these barriers by introducing a wafer scale transfer process that allows the selective transfer of heat-treated and micromachined shape memory alloy (SMA) film or foil microactuators to randomly selected receiving sites on a target substrate. The technology relies on a temporary adhesive bonding layer between SMA film/foil and an auxiliary substrate, which can be removed by laser ablation. The transfer technology was tested for microactuators of a cold-rolled NiTi foil of 20 μm thickness, which were heat-treated in free-standing condition, then micromachined on an auxiliary substrate of glass, and finally selectively transferred to different target substrates of a polymer. For demonstration, the new technology was used for batch-fabrication of SMA-actuated polymer microvalves.

Keywords

Shape Memory Alloy European Physical Journal Special Topic Electrical Resistance Characteristic Glass Wafer Shape Memory Material 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© EDP Sciences/Società Italiana di Fisica/Springer-Verlag 2008

Authors and Affiliations

  • T. Grund
    • 1
  • R. Guerre
    • 2
  • M. Despont
    • 2
  • M. Kohl
    • 1
  1. 1.Forschungszentrum Karlsruhe, IMT, Postfach 3640KarlsruheGermany
  2. 2.IBM Research GmbH, Zürich Research LaboratoryRüschlikonSwitzerland

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