The effect of copper ion on microstructure, plating rate and anticorrosive performance of electroless Ni-P coating on AZ61 magnesium alloy
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In this paper, the effects of copper ion addition on microstructure, composition, deposition rate and anticorrosive performance of electroless Ni-P coating on AZ61 magnesium alloy have been investigated. Deposits were characterized by X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray (EDX) techniques. The corrosion behavior of the deposits was studied by Open Circuit Potential (OCP) measurements and Electrochemical Impedance Spectroscopy (EIS) in 3.5 wt % NaCl. Moreover, the deposition rate of the coatings was determined by polarization tests. The results indicate that introduction of Cu2+ improves the characteristics and anticorrosion performance of Ni-P coating.
KeywordsMagnesium Alloy Electrochemical Impedance Spectroscopy Open Circuit Potential Electroless Plating AZ61 Magnesium Alloy
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