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The effect of copper ion on microstructure, plating rate and anticorrosive performance of electroless Ni-P coating on AZ61 magnesium alloy

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Abstract

In this paper, the effects of copper ion addition on microstructure, composition, deposition rate and anticorrosive performance of electroless Ni-P coating on AZ61 magnesium alloy have been investigated. Deposits were characterized by X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray (EDX) techniques. The corrosion behavior of the deposits was studied by Open Circuit Potential (OCP) measurements and Electrochemical Impedance Spectroscopy (EIS) in 3.5 wt % NaCl. Moreover, the deposition rate of the coatings was determined by polarization tests. The results indicate that introduction of Cu2+ improves the characteristics and anticorrosion performance of Ni-P coating.

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Authors and Affiliations

  1. Physical Chemistry Research Laboratory, Applied Chemistry Department, Faculty of Science, University of Mohaghegh Ardabili, Ardabil, Iran

    Z. Rajabalizadeh & D. Seifzadeh

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  1. Z. Rajabalizadeh
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  2. D. Seifzadeh
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Correspondence to D. Seifzadeh.

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Rajabalizadeh, Z., Seifzadeh, D. The effect of copper ion on microstructure, plating rate and anticorrosive performance of electroless Ni-P coating on AZ61 magnesium alloy. Prot Met Phys Chem Surf 50, 516–523 (2014). https://doi.org/10.1134/S2070205114040157

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  • DOI: https://doi.org/10.1134/S2070205114040157

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