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Polymer Science, Series D

, Volume 10, Issue 2, pp 95–98 | Cite as

Residual stresses at hardening of disperse-filled epoxy systems

  • A. N. Trofimov
  • N. V. Apeksimov
  • I. D. Simonov-Emel’yanov
Article
  • 16 Downloads

Abstract

The influence of MS-VP-A9 brand hollow glass microspheres and curing temperature on the kinetics of growth of residual stresses in disperse-filled polymer composites based on DER-330 and ED-20 epoxy oligomers was considered. It was shown that the introduction of hollow glass microspheres and change of generalized parameters of structure leads to a decrease of the level of residual stresses by approximately half during curing, differing in average molecular weight, molecular-weight distribution, and content of associates.

Keywords

residual stresses polymer composites filler epoxy oligomers disperse structure 

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Copyright information

© Pleiades Publishing, Ltd. 2017

Authors and Affiliations

  • A. N. Trofimov
    • 1
  • N. V. Apeksimov
    • 2
  • I. D. Simonov-Emel’yanov
    • 2
  1. 1.JSC NPO FiberglassSolnechnogorsk raion, Moscow oblastRussia
  2. 2.Moscow Technological UniversityMoscowRussia

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