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Polymer Science Series C

, Volume 49, Issue 1, pp 84–88 | Cite as

Use of thermal analysis techniques for studying a hot-melt adhesive

  • I. I. Khairullin
  • V. M. Aleksashin
  • A. P. Petrova
Article

Abstract

Examples of the use of thermal analysis instruments and techniques for the investigation and formulation of hot-melt adhesives are reported, and the feasibility of an immediate study of the effect of various components and process additives on the thermal, physical, and mechanical characteristics of adhesive joints is discussed.

Keywords

Glass Transition Temperature Polymer Science Series Melting Peak Vinyl Acetate Adhesive Joint 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    A. P. Petrova, Adhesive Materials Handbook, Ed. by E. N. Kablov and S. V. Reznichenko (K i R, Moscow, 2002) [in Russian].Google Scholar
  2. 2.
    V. A. Bershtein and V. M. Egorov, Differential Scanning Calorimetry in Physical Chemistry of Polymers (Khimiya, Leningrad, 1990) [in Russian].Google Scholar
  3. 3.
    V. M. Aleksashin and N. V. Antyufeeva, Klei Germet. Tekhnol., No. 12, 28 (2005).Google Scholar
  4. 4.
    E. R. Mukhamedzyanova, Extended Abstract of Candidate’s Dissertation in Technical Sciences (Kazan, 2002).Google Scholar

Copyright information

© Pleiades Publishing, Ltd. 2007

Authors and Affiliations

  • I. I. Khairullin
    • 1
  • V. M. Aleksashin
    • 1
  • A. P. Petrova
    • 1
  1. 1.All-Russia Institute of Aircraft MaterialsMoscowRussia

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