Abstract
Deep-level transient spectroscopy is used to study both the concentration profiles of defects introduced into silicon during the implantation of 14-MeV boron ions and the transformation of these defects as a result of subsequent annealing at temperatures in the range from 200 to 800°C. It is ascertained that implantation gives rise to a standard set of vacancy-containing radiation defects (the oxygen-vacancy and phosphorusvacancy complexes and divacancies) and to a center with the level located at E c − 0.57 eV. Heat treatments at temperatures of 200–300°C bring about the disappearance of all vacancy-containing complexes at a distance from the surface h > 12−9 µm. Most likely, this phenomenon is caused by the decomposition of interstitial-containing complexes located at a depth h > 12−9 µm and their annihilation with the vacancy-containing complexes. Heat treatments at higher temperatures bring about both a further narrowing of the layer that still contains the vacancy-type defects to h ≈ 6 µm at 500°C and a change in the set of observable electrically active centers in the temperature range from 400 to 500°C. Specific features of the annealing of radiation defects after high-energy ion implantation are caused by spatial separation of the vacancy-and interstitial-containing defects.
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References
V. Privitera, S. Coffa, F. Priolo, et al., Nucl. Instrum. Methods Phys. Res. B 120, 9 (1996).
A. Agarwal, K. Christinsen, D. Venables, et al., Appl. Phys. Lett. 69, 3899 (1996).
R. A. Brown, O. Kononchuk, G. A. Rozgonyi, et al., J. Appl. Phys. 84, 2459 (1998).
R. Koglar, R. Yankov, J. R. Kaschny, et al., Nucl. Instrum. Methods Phys. Res. B 142, 493 (1998).
A. Kvit, R. A. Yankov, G. Duscher, et al., Appl. Phys. Lett. 83, 1367 (2003).
V. C. Venezia, L. Pelaz, H.-J. L. Grossmann, et al., Appl. Phys. Lett. 79, 1273 (2001).
P. I. Gaiduk, A. N. Larsen, J. L. Harsen, and C. Trautmann, Appl. Phys. Lett. 83, 1746 (2003).
S. A. Smagulova, I. V. Antonova, E. P. Neustroev, and V. A. Skuratov, Fiz. Tekh. Poluprovodn. (St. Petersburg) 37, 565 (2003) [Semiconductors 37, 546 (2003)].
I. V. Antonova, E. P. Neustroev, A. Misiuk, and V. A. Skuratov, Solid State Phenom. 82–84, 243 (2002).
P. Hazdra, J. Rubes, and J. Vobecky, Nucl. Instrum. Methods Phys. Res. B 159, 207 (1999).
Problems in Radiation Technology of Semiconductors, Ed. by L. S. Smirnov (Nauka, Novosibirsk, 1980) [in Russian].
I. V. Antonova, A. V. Vasil’ev, V. M. Panov, and S. S. Shaĭmeev, Fiz. Tekh. Poluprovodn. (Leningrad) 23, 998 (1989) [Sov. Phys. Semicond. 23, 671 (1989)].
T. H. Lee, N. N. Gerasimenko, and J. J. Corbett, Phys. Rev. B 14, 4506 (1976).
A. V. Vasil’ev, M. A. Kopshik, S. A. Smagulova, et al., Fiz. Tekh. Poluprovodn. (Leningrad) 17, 1155 (1983) [Sov. Phys. Semicond. 17, 729 (1983)].
J. L. Benton, L. O. Kimerlin, and M. Stavola, Physica B (Amsterdam) 116, 271 (1983).
V. P. Markovich and L. M. Murin, Fiz. Tekh. Poluprovodn. (Leningrad) 25, 1737 (1991) [Sov. Phys. Semicond. 25, 1045 (1991)].
I. V. Antonova, V. P. Popov, A. E. Plotnikov, and A. Misiuk, J. Electrochem. Soc. 146, 1575 (1999).
S. Fatima, J. Wong-Leung, J. Fitz Gerald, and C. Jagadish, Appl. Phys. Lett. 74, 1141 (1999).
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Original Russian Text © I.V. Antonova, S.S. Shaĭmeev, S.A. Smagulova, 2006, published in Fizika i Tekhnika Poluprovodnikov, 2006, Vol. 40, No. 5, pp. 557–562.
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Antonova, I.V., Shaĭmeev, S.S. & Smagulova, S.A. Transformation of electrically active defects as a result of annealing of silicon implanted with high-energy ions. Semiconductors 40, 543–548 (2006). https://doi.org/10.1134/S106378260605006X
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DOI: https://doi.org/10.1134/S106378260605006X