Polymer Science, Series A

, Volume 60, Issue 6, pp 886–893 | Cite as

Evaluation of Electrical Carrier Transport Mechanism in Plasma Polymerized n-Butyl Methacrylate Thin Films

  • Rahima NasrinEmail author
  • A. H. Bhuiyan
Transport in Polymers


Aluminium/poly(n-butyl methacrylate)/aluminium pattern thin films of different thickness were fabricated through plasma polymerization technique and their DC electrical characterization was conducted with a view of better understanding of the electrical charge transport mechanism. The current density—voltage and current density—film thickness characteristics of fabricated thin films of different thickness indicated that the dominant conduction mechanism in the higher voltage region is space charge limited conduction. The estimated carrier mobility, trap density and free carrier density decreased with the increase of thickness of the prepared thin films.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    J. Ahmad, K. Bazaka, K. Vasilev, and M. V. Jacob, J. Appl. Polym. Sci. 132, 2318 (2015).CrossRefGoogle Scholar
  2. 2.
    C. J. Mathai, M. R. Anantharaman, S. Venkatachalam, and S. Jayalekshmi, Thin Solid Films 416, 10 (2002).CrossRefGoogle Scholar
  3. 3.
    Y. Kagami, T. Yamauchi, and Y. Osada, J. Appl. Phys. 68, 610 (1990).CrossRefGoogle Scholar
  4. 4.
    T. Afrozeand and A. H. Bhuiyan, Polym. Eng. Sci. 55, 2729 (2015).CrossRefGoogle Scholar
  5. 5.
    H. Kabir, M. M. Rahman, K. M. Uddin, and A. H. Bhuiyan, Appl. Surf. Sci. 423, 98 (2017).CrossRefGoogle Scholar
  6. 6.
    J. Ahmad, K. Bazaka, and M. Jacob, Electronics 3, 266 (2014).CrossRefGoogle Scholar
  7. 7.
    R. D’Agostino, Plasma Deposition, Treatment, and Etching of Polymers (AcademicPress, San Diego, CA, 1990).Google Scholar
  8. 8.
    U. Bach, D. Lupo, P. Comte, J. E. Moser, F. Weissortel, J. Salbeck, H. Spreitzer, and M. Gratzel, Nature 395, 583 (1998).CrossRefGoogle Scholar
  9. 9.
    Z. Bao and J. Locklin, Organic Field Effect Transistors (CRC Press, Boca Raton, 2007).CrossRefGoogle Scholar
  10. 10.
    X. Jiang, W. F. Burgoyne, and L. M. Robeson, Polymer 47, 4124 (2006).CrossRefGoogle Scholar
  11. 11.
    C. J. Drury, C. M. J. Mutsaears, C. M. Hart, M. Matters, and D. M. de Leeuw, Appl. Phys. Lett. 108, 73 (1998).Google Scholar
  12. 12.
    H. Kabir, A. H. Bhuiyan, and M. M. Rahman, Thin Solid Films 609, 35 (2016).CrossRefGoogle Scholar
  13. 13.
    A. A. Jumaili, S. Alancherry, K. Bazaka, and M. V. Jacob, Electronics 6, 86 (2017).CrossRefGoogle Scholar
  14. 14.
    A. B. M. Shah Jalal, S. Ahmed, A. H. Bhuiyan, and M. Ibrahim, Thin Solid Films 295, 125(1997).Google Scholar
  15. 15.
    P. Shukla and M.S. Gaur, J. Appl. Polym. Sci. 114, 222 (2009).CrossRefGoogle Scholar
  16. 16.
    F. Namouchi, H. Smaoui, N. Fourati, C. Zerrouki, H. Guermazi, and J. J. Bonnet, J. Alloys Compd. 469, 197 (2009).CrossRefGoogle Scholar
  17. 17.
    L. N. Ismail, M. Khairizal, Z. Habibah, A. N. Arshad, M. H. Wahid, N. N. Hafizah, S. H. Herman, and M. Rusop, in Proceedings of the 34th International Conference on Software Engineering (IEEE ICSE 2012), Zurich, Switzerland, 2012 (Zurich, 2012), p.65.Google Scholar
  18. 18.
    Y. Yuan, L. Changsheng, and Y. Min, J. Mater. Sci.: Mater. Electron. 19, 2187 (2008).Google Scholar
  19. 19.
    S. H. Deshmukh, D. K. Burghate, V. P. Akhare, V. S. Deogaonkar, P. T. Deshmukh, and M. S. Deshmukh, Mater. Sci. 30, 51 (2007).Google Scholar
  20. 20.
    W. Ao, J.-S. Limand, and P.-K. Shin, J. Electr. Eng. Technol. 6, 836 (2011).CrossRefGoogle Scholar
  21. 21.
    J. H. Park, D. K. Hwang, J. Lee, and E. Kim, Thin Solid Films 515, 4041 (2007).CrossRefGoogle Scholar
  22. 22.
    R. Nasrin and A. H. Bhuiyan, Surf. Rev. Lett. (2018). doi 10.1142/S0218625X18501469Google Scholar
  23. 23.
    R. Nasrin, K. S. Hossain, and A. H. Bhuiyan, Appl. Phys. A: Mater. Sci. Process. 124, 391 (2018).CrossRefGoogle Scholar
  24. 24.
    M. J. Rahman and A. H. Bhuiyan, Thin Solid Films 534, 132(2013).Google Scholar
  25. 25.
    S. Tolansky, Multiple Beam Interferometry of Surfaces and Films (Clarendon Press, Oxford, 1948).Google Scholar
  26. 26.
    K. Suhailath, M. T. Ramesan, B. Naufal, P. Periyat, V. C. Jasna, and P. Jayakrishnan, Polym. Bull. 74, 671 (2017).CrossRefGoogle Scholar
  27. 27.
    M. M. Kamal and A. H. Bhuiyan, J. Mod. Sci. Technol. 2, 1 (2014).Google Scholar
  28. 28.
    R. Valaski, S. Ayoub, L. Micaroni, I. A. Hümmelgen, Thin Solid Films 415, 206 (2002).CrossRefGoogle Scholar
  29. 29.
    R. B. Sarker and A. H. Bhuiyan, Thin Solid Films 519, 5912 (2011).CrossRefGoogle Scholar
  30. 30.
    D. R. Lamb, Electrical Conduction Mechanism in Thin Insulating Films (Methuen, London, 1967).Google Scholar
  31. 31.
    M. A. Lampert, Phys. Rev. 103, 1648 (1956).CrossRefGoogle Scholar
  32. 32.
    M. A. Lampert and P. Mark, Current Injection in Solids (Academic Press, New York, 1970).Google Scholar
  33. 33.
    R. S. Muller, Solid-State Electron. 6, 25 (1963).CrossRefGoogle Scholar
  34. 34.
    R. D. Gould, J. Appl. Phys. 53, 3353 (1982).CrossRefGoogle Scholar

Copyright information

© Pleiades Publishing, Ltd. 2018

Authors and Affiliations

  1. 1.Department of PhysicsBangladesh University of Engineering and Technology (BUET)DhakaBangladesh
  2. 2.Department of PhysicsUniversity of BarisalBarisalBangladesh

Personalised recommendations