Abstract
In this work a bi-material beam exhibiting partly bilinear behaviour under a uniform temperature change is analyzed. The essence of solution is based on the approach of Timoshenko’s mechanics of materials. The main aim of the present analysis is to understand the effect of the bilinear behaviour on the peeling moment. This theoretical mechanics model mentioned here can give us useful insights to improve the resistance against the delamination.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Timoshenko, S.P., Analysis of bimetal thermostats. Journal of Optical Society American, 1925, 11: 233–255.
Hess, M.S., The end problem for a laminated elastic strip—I. The general solution. Journal of Composites Materials, 1969, 3: 262–280.
Hess, M.S., The end problem for a laminated elastic strip—II. Differential expansion stresses. Journal of Composites Materials, 1969, 3: 630–641.
Suhir, E., Stresses in bimetal thermostats. ASME Journal of Applied Mechanics, 1986, 53: 657–660.
Suhir, E., Interfacial stresses in bimetal thermostats. ASME Journal of Applied Mechanics, 1989, 56: 595–600.
Suhir, E., Predicted thermal stresses in a bi-material assembly adhesively bonded at the ends. Journal of Applied Physics, 2001, 89: 120–129.
Mirman, I.B., Effects of peeling stresses in a bi-material assembly. ASME Journal of Electronic Packaging, 1991, 113: 431–433.
Mirman, I.B., Microelectronics and the built-up-bar theory. ASME Journal of Electronic Packaging, 1992, 114: 384–388.
Mirman, I.B., Interlaminar stresses in layered beams. ASME Journal of Electronic Packaging, 1992, 114: 389–396.
Moore, T.D. and Jarvis, J.L., A simple and fundamental design rule for resisting delamination in bi-material structures. Microelectronic Reliability, 2003, 43: 487–494.
Moore, T.D. and Jarvis, J.L., The peeling moment a key rule for delamination resistance in I.C. assemblies. ASME Journal Electronic Packaging, 2004, 126: 106–109.
Moore, T.D. and Jarvis, J.L., Peeling in bi-material beams: the peeling moment and its relation to the differential rigidity. ASME Journal of Applied Mechanics, 2004, 71: 290–292.
Gent, A.N. and Hamed, G.R., Peel mechanics. Journal of Adhesion, 1975, 7: 91–95.
Gere, J.M. and Timoshenko, S.P., Mechanics of Materials. 3rd ed. London: Chapman-Hall, 1991.
Yuan, H, Chen, J.F., Teng, J.G. and Lu, X.Z., Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading. International Journal of Solids and Structures, 2007, 44: 5247–5271.
Kamiya, N., Thermal stress in a bimodulus thick cylinder. Nuclear Engineering and Design, 1977, 40: 383–391.
Eischen, J.W., Chung, C. and Kim, J.H., Realistic modelling of edge effect stresses in bi-material elements. ASME Journal of Electronic Packaging, 1990, 112: 16–23.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Güven, U. The Effect of Bilinear Behaviour on the Direction and Magnitude of the Peeling Moment in a Bi-Material Beam. Acta Mech. Solida Sin. 24, 506–509 (2011). https://doi.org/10.1016/S0894-9166(11)60050-5
Received:
Revised:
Published:
Issue Date:
DOI: https://doi.org/10.1016/S0894-9166(11)60050-5