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Mechanics analysis of two-dimensionally prestrained elastomeric thin film for stretchable electronics

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Abstract

Various methods have been developed to fabricate highly stretchable electronics. Recent studies show that over 100% two dimensional stretchability can be achieved by mesh structure of brittle functioning devices interconnected with serpentine bridges. Kim et al show that pressing down an inflated elastomeric thin film during transfer printing introduces two dimensional prestrain, and therefore further improves the system stretchability. This paper gives a theoretical study of this process, through both analytical and numerical approaches. Simple analytical solutions are obtained for meridional and circumferential strains in the thin film, as well as the maximum strain in device islands, which all agree reasonably well with finite element analysis.

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  1. These authors contribute equally.

Authors and Affiliations

  1. State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian, 116024, China

    Ming Li & Zhan Kang

  2. Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA

    Ming Li, Jian Wu & Yonggang Huang

  3. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA

    Jianliang Xiao, Rak-Hwan Kim & John A. Rogers

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  1. Ming Li
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  2. Jianliang Xiao
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Correspondence to Yonggang Huang.

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Project supported by the NSF (Nos. DMI-0328162 and ECCS-0824129). Yonggang Huang also acknowledges the support from NSFC and Ming Li acknowledges the support from China Scholarship Council.

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Li, M., Xiao, J., Wu, J. et al. Mechanics analysis of two-dimensionally prestrained elastomeric thin film for stretchable electronics. Acta Mech. Solida Sin. 23, 592–599 (2010). https://doi.org/10.1016/S0894-9166(11)60006-2

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  • DOI: https://doi.org/10.1016/S0894-9166(11)60006-2

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