An optimization approach for automotive power semiconductor switch module with shunt resistor using an inlay printed circuit board (PCB) is proposed in this study to analyze electrical and thermal characteristics under a given maximum temperature rise constraint. The final module with a shunt resistor and current measurement block is designed and manufactured by adopting the optimization results. The performance is measured and compared with a conventional module without a shunt resistor, which was manufactured before optimizing. The number of MOSFETs used in the module decreased from six to four while satisfying a maximum temperature rise of 20 °C. Therefore, optimization increases the price competitiveness of the power module.
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This work was supported by the Development of Core Industrial Technology (Grant no. 10080329, Development of high-density power conversion system based on SiC for green cars that can reduce the volume by more than 30%) and funded by the Korean Ministry of Trade, Industry, & Energy (MOTIE) and the Korea Institute for Advancement of Technology (KIAT). The grant was funded by the Korean Government (MOTIE) (N0001883, The Competency Development Program for Industry Specialists).
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Kim, CW., Do, HJ., Hwang, TY. et al. Optimization of an automotive power semiconductor switch module using inlay PCB technology. J. Power Electron. 21, 660–671 (2021). https://doi.org/10.1007/s43236-020-00211-7
- Automotive switch module
- Heat distribution
- Inlay PCB
- Module cost
- Parasitic resistance