Abstract
Thin AlN layer was deposited on n-type 4H-SiC using atomic layer deposition and the electrical properties of Pt/SiC Schottky diodes with and without AlN layer were comparatively investigated. Based on the capacitance–voltage (C–V) and conductance–voltage (G/ω–V) characteristics, the interface state density decreased but the oxide trap density increased with an AlN layer. The border traps present near the AlN/SiC interface might produce such difference. Compared to the sample without AlN, both the barrier height and the ideality factor increased with an AlN. Analyses on the reverse leakage current density for Pt/AlN/SiC junction showed that the dominant transport mechanisms are ohmic conduction, trap assisted tunneling (TAT) and Fowler–Nordheim emissions at low, intermediate, and high electric field regions, respectively. Both the nitrogen vacancies and dangling bonds in Al in AlN layer were suggested to contribute to the TAT conduction.
Similar content being viewed by others
References
J. Wu, J. Appl. Phys. 106, 011101 (2009)
S. Sadeghpour, F. Ceyssens, R. Puers, J. Phys. Conf. Ser. 757, 012003 (2016)
G. Banal, M. Funato, Y. Kawakami, Appl. Phys. Lett. 92, 241905 (2008)
M. Alevli, C. Ozgit, I. Donmez, N. Biyikli, J. Cryst. Growth 335, 51 (2011)
M. Bosund, P. Mattila, A. Aierken, T. Hakkarainen, H. Koskenvaara, M. Sopanen, V. Airaksinen, H. Lipsanen, Appl. Surf. Sci. 256, 7434 (2010)
H. Shih, W. Lee, W. Kao, Y. Chuang, R. Lin, H. Lin, M. Shiojiri, M. Chen, Sci. Rep. 7, 39717 (2017)
G. Liu, E. Deguns, L. Lecordier, G. Sundaram, J. Becker, ECS Trans. 41, 219 (2011)
O. Kim, D. Kim, T. Anderson, J. Vac. Sci. Technol. A 27, 923 (2009)
J. Casady, R. Johnson, Solid State Electron. 39, 1409 (1996)
M. Yoder, IEEE Trans. Electron. Devices 43, 1633 (1996)
I. Shalish, C. de Oliveira, Y. Shapira, L. Burstein, M. Eizenberg, J. Appl. Phys. 88, 5724 (2000)
S. Huang, Q. Jiang, S. Yang, Z. Tang, K. Chen, IEEE Electron Device Lett. 34, 193 (2013)
D. Cao, X. Cheng, Y. Xie, L. Zheng, Z. Wang, X. Yu, J. Wang, D. Shen, Y. Yu, RSC Adv. 5, 37881 (2015)
P. Mattila, M. Bosund, T. Huhtio, H. Lipsanen, M. Sopanen, J. Appl. Phys. 111, 063511 (2012)
T. Mandel, M. Frischolz, R. Helbig, S. Birkle, A. Hammerschimdt, Appl. Surf. Sci. 65–66, 795 (1993)
E. Nicollian, J. Brews, MOS Physics and Technology (Wiley, New York, 1982)
K. Cheong, S. Dimitrijev, IEEE Electron Device Lett. 23, 404 (2002)
J. Campi, Y. Shi, Y. Luo, F. Yan, J. Zhao, IEEE Trans. Electron Devices 46, 511 (1999)
T. Hossain, D. Wei, J. Edgar, N. Garces, N. Nepal, J. Hite, M. Mastro, C. Eddy Jr., J. Vac. Sci. Technol. B 33, 061201 (2015)
Y. Shi, Q. Zhou, A. Zhang, L. Zhu, Y. Shi, W. Chen, Z. Li, B. Zhang, Nanoscale Res. Lett. 12, 342 (2017)
N. Shiwakoti, A. Bobby, K. Asokan, B. Antony, Mater. Sci. Semicond. Process. 74, 1 (2018)
H. Yoshioka, T. Nakamura, T. Kimoto, J. Appl. Phys. 111, 014502 (2012)
P. Fiorenza, G. Greco, F. Iucolano, A. Patti, F. Roccaforte, Appl. Phys. Lett. 106, 142903 (2015)
H. Altuntas, C. Ozgi-Akgun, I. Donmez, N. Biyikli, J. Appl. Phys. 117, 155101 (2015)
D. Cociorva, W. Aulbur, J. Wilkins, Solid State Commun. 124, 63 (2002)
J. Choi, R. Puthenkovilakam, J. Chang, Appl. Phys. Lett. 86, 192101 (2005)
T. Apostolova, D. Huang, P. Alsing, D. Cardimona, Phys. Rev. A 71, 013810 (2005)
V. Ligatchev, Rusli, Z. Pan, Appl. Phys. Lett. 87, 242903 (2005)
T. Tansley, R. Egan, Phys. Rev. B 45, 10942 (1992)
C. Wu, A. Kahn, Appl. Phys. Lett. 74, 546 (1999)
M. Gronera, J. Elama, F. Fabreguettea, S. Georgea, Thin Solid Films 413, 186 (2002)
V. Afanasev, F. Ciobanu, S. Dimitrijev, G. Pensl, A. Stesmans, J. Phys. Condens. Matter 16, S1839 (2004)
M. Avice, U. Grossner, I. Pintilie, B. Svensson, O. Nilsen, H. Fjellvag, Appl. Phys. Lett. 89, 222103 (2006)
M. Usman, A. Hallén, T. Pilvi, A. Schöner, M. Leskeläb, J. Electrochem. Soc. 158, H75 (2011)
S. Liu, S. Yang, Z. Tang, Q. Jiang, C. Liu, M. Wang, B. Shen, K. Chen, Appl. Phys. Lett. 106, 051605 (2015)
K. Kim, M. Hu, D. Liu, J. Kim, K. Chen, Z. Ma, Nano Energy 43, 259 (2018)
R. Khosa, E. Thorsteinsson, M. Winters, N. Rorsman, R. Karhu, J. Hassan, E. Sveinbjörnsson, AIP Adv. 8, 025304 (2018)
Acknowledgements
This study was supported by the Research Program funded by the Seoul National University of Science and Technology(Seoultech).
Author information
Authors and Affiliations
Corresponding authors
Rights and permissions
About this article
Cite this article
Kim, H., Kim, N.D., An, S.C. et al. Effect of Atomic Layer Deposited AlN Layer on Pt/4H-SiC Schottky Diodes. Trans. Electr. Electron. Mater. 19, 235–240 (2018). https://doi.org/10.1007/s42341-018-0058-0
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s42341-018-0058-0